4-layer rigid PCB with gold finger, impedance control, outer finish copper of 2oz

Goldfinger chem Ni/Au 4-layer PCB with red soldermask

HDI 6-layer board with FR-4 Tg150 and chem Ni/Au

Multilayer PCBS, for 6-layer PCB with 2.3mm board thickness and chem Ag

4-layer PCB, 1/1oz, FR4 Base Material, 1.0mm Board Thickness and Chem Ni/Au

4-layers PCBS for Immersion Gold with Applied in Mobile Phone

Multi-layer PCBs, 4-layer FR-4 PCB with Solder Mask Black and Surface OSP, for LED

6-layer Immersion Gold Impedance PCB with Board Thickness of 39.4mils

6-layer Multilayer PCBs, Chem Ni/Au Surface Finish and 2.0mm Thickness Board, with Impedance Control

4-layer FR-4 PCBs with 1.5mm Thick Board, Chem Ni/Au Surface and Green Solder Mask

10-layer Rigid-flex PCBs, 1.6mm board thickness and ENIG surface finish, with green solder mask

Rigid-flex PCBs, 4-layer PI + FR4, Surface Finish ENIG and 1.6mm Thickness/with 0.4mm Flex Thickness

4-layer rigid-flex PCBs, PI+FR4, ENIG surface finish, 1.6mm board and 0.85mm flex thickness

8-layer FR-4 PCBs, 2oz copper thickness and surface Chem with gold-finger

6-layer HDI PCBs with blind and buried holes, surface ENIG and impedance control for mobile phone

High-density 12-layer, FR4 PCBs 1.8mm Thickness and Chem Ni/Au for Cellphone PCB

8-layer FR-4 Tg170 PCBs, Surface Flash Gold and 2.3mm Board Thickness with Impedance Control

8-layer HDI PCBs, Impedance Control and Immersion Gold, Application for Mobile Phone

8-layer FR-4 HDI PCBs, LF Surface and 0.1mm Laser Vias, for Automotive Engine Control

HDI Multilayer PCBs, 8-layer 1.8mm Board Thickness and Immersion Gold for Mobile Phone