High-density multilayer PCBs

12 Embedded System PCB with Copper Thickness of 1oz

12-layered PCB with Immersion Gold Finish and 76.2mils Board Thickness

6-layer Immersion Gold Impedance PCB with Board Thickness of 39.4mils

14 -layered HDI PCB with ENIG Surface Treatment

6-layer HDI PCB with Copper Thickness of 1/4oz

6-layered HAL PCB with 0.5oz Copper Thickness and 62mils Board Thickness

4-layer Blind Immersion Gold PCB with Board Thickness of 23.62 Mils

10-layer ENIG PCB with 3/3mils Minimum Line Wideth/Gap

6-layer ENIG PCB with 0.2mm BGA and 1.60mm Thickness

4-layer ENIG PCB with Golden Fingers and Immersion Gold Surface Finish

Four Layers PCB with 0.35mm BGA

6 Layers PCB with Red Soldermask

6-layers High-density Multilayer PCBs with 2 Times Buried and Blind Vias

6-Layer HDI PCB's with Copper Plugged Vias Special Treatment

15.75mils Board Thickness 4-layer PCB with Immersion Gold Type of Surface-finish

Ten-layer Rigid-flex PCB with Immersion Gold Surface Finish

38.1mil Board Thickness 6-layer Display Card PCB with HAL-LF and Hard Gold Surface Finish

12-layer PCB with 4OZ copper

20-layer Thick PCB with Countersink and Copper Thickness of 1oz

8-layered Main Board for Mobile Phones, with OSP BGA Surface Finish