Basic Info
Basic Info
Product Description
Product Description
Our Product:
PCB material: FR4\FPC\Aluminium\Ceramic
Layer: 1-16 layer
Min.Line/Space: 0.1mm
Min.Hole: 0.2mm
Thickness: 0.2-3.2mm(FR4)
Max.Copper: 4oz
Surface treating: Pb free HAL Chem. Au. Immersion Tin/Silver. OSP.
No MOQ. Both mass production and prototype are welcome.
Shorter lead time. Competitive price and high quality.
PCB material: FR4\FPC\Aluminium\Ceramic
Layer: 1-16 layer
Min.Line/Space: 0.1mm
Min.Hole: 0.2mm
Thickness: 0.2-3.2mm(FR4)
Max.Copper: 4oz
Surface treating: Pb free HAL Chem. Au. Immersion Tin/Silver. OSP.
No MOQ. Both mass production and prototype are welcome.
Shorter lead time. Competitive price and high quality.