Multilayer PCB with Immersion Tin Finish, Used for Telecommunication Products

Type: six-layer HDI PCB for mobile phones
Materials: Tg ≥170°C
Surface finishes: lead-free HAL, HAL, flash gold, immersion gold, immersion tin, immersion silver, OSP, gold finger plating, carbon ink printing and peelable blue mask (peters 2954)
Technology: blind vias, buried vias, sel ective plating and micro vias (laser drill)
Surface: high temperature tolerance OSP (Cu-106A HT (x))
Used for multi-function products