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What is the PCB origin and development history?

Printed Circuit Board (PCB), also known as Printed Circuit Board in Chinese, is the support body of electronic components and the carrier of electrical connection of electronic components. The traditional circuit board uses the method of printing etching inhibitor to make circuit lines and drawings, so it is called printed circuit board or printed circuit board.

The circuit board we usually see is based on PCB welded components, namely PCBA (PCB Assembly), PCB is "bare board", "bare board", that is, PCB is the circuit board without welded components. PCB and circuit components through the process of assembly and assembly to form the actual use of electronic products in the circuit board.
History of PCB in the world

In 1936, Paul Eisler, the Austrian inventor of printed circuit boards, was the first to use printed circuit boards in radio devices.

In 1943, the Americans mostly used this technology in military radios.

In 1947, NASA and THE American Bureau of Standards initiated the first technical discussion on PCB.

The invention was officially approved for commercial use by the United States in 1948.

In the early 1950s, since the problems of CCL copper foil and laminate bonding strength and welding resistance were solved, the performance was stable and reliable, and large-scale industrial production was realized. Copper foil etching method became the mainstream of PCB manufacturing technology, and single panel production began.

In the 1960s, double-sided PCBS with metallized holes were mass-produced.

In the 1970s, multi-layer PCB developed rapidly, and continued to develop towards the direction of high precision, high density, fine line holes, high reliability, low cost and automatic continuous production.

In the 1980s, surface mounted printed boards (SMT) gradually replaced plug-in PCBS and became the mainstream of production.

Since the 1990s, surface mounting has further developed from flat package (QFP) to Spherical shan array package (BGA).

Since the 21st century, high density BGA, chiplevel packaging and multi-chip module packaging PCB based on organic laminate material have been developed rapidly.
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History of PCB in China

In 1956, PCB development began in China.

1960s, mass production of single panel, small batch production of double-sided school and began to develop multilayer board.

In the 1970s, due to the restriction of historical conditions at that time, the development of printed board technology is slow, making the whole production technology lags behind the advanced level of foreign countries.

In the 1980s, advanced single-sided, double-sided and multi-layer PCB production lines were introduced from abroad, which improved the technical level of China's PCB production

In the 1990s, Hong Kong, Taiwan and Japan and other foreign PCB manufacturers have come to China to set up joint ventures and wholly owned factories, so that China's OUTPUT and technology of PCB by leaps and bounds.

In 2002, it became the third largest PCB producer.

In 2003, PCB output value, import and export value both exceeded 6 billion US dollars, surpassing the US for the first time and becoming the world's second largest PCB output country. The proportion of OUTPUT value also doubled from 8.54% in 2000 to 15.30%.

In 2006, China has replaced Japan to become the world's largest PCB production base and the most active technology development country.

In recent years, China's PCB industry has maintained a high growth rate of about 20%, much higher than the growth rate of the global PCB industry.