What is the difference between SMT and SMD?

SMD is short for Surface Mounted Devices, which means: Surface Mount device, it is one of the SMT(Surface Mount Technology) components, including CHIP, SOP, SOJ, PLCC, LCCC, QFP, BGA, CSP, FC, MCM, etc.

The introduction of surface mount components about two decades ago ushered in a new era. From passive components to active components and integrated circuits, they eventually become surface mount devices (SMDS) and can be assembled by pick-up and drop devices. For a long time it was assumed that all pin components would eventually be available in SMD packages.

SMT is the abbreviation of Surface Mount Technology, which means: Surface assembly Technology, is the most popular Technology and process in the electronic assembly industry at present.

SMT is a new generation of electronic assembly technology, it will be the traditional electronic components into the volume of only dozens of components, so that the assembly of electronic products to achieve high density, high reliability, miniaturization, low cost, and production automation. This miniaturized component is called: SMD device (or SMC, chip device). The process of assembling components onto a printed board PCB is called SMT process.

Now SMT technology is mainly through the equipment to achieve, called SMT equipment, the main plate machine, solder paste printing machine, automatic SMT machine, reflow furnace, and a variety of auxiliary tools and equipment