rogers high frequency pcb

What materials are generally used as substrates for high-frequency circuit PCBs?

High frequency board refers to a special circuit board with a higher electromagnetic frequency. It is used for high frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meter). The copper board is a circuit board produced by using part of the process of the ordinary rigid circuit board manufacturing method or using a special processing method. Generally speaking, a high-frequency board can be defined as a circuit board with a frequency above 1GHz.

Therefore, in order to meet the requirements of high frequency, high speed, high density, high dielectric constant (DK≤3), low loss factor (DF≤0.005), glass transition temperature (TG>165℃), and good dimensional stability (low CTE) , CAF resistance (conductive anode wire) and good processability require mobile terminal boards. The rigid board substrate of Rigid-Flex Board is preferably fluorinated resin (PTFE, polytetrafluoroethylene), and the flexible board substrate is preferably modified polyimide (MPI) or liquid crystal polymer (LCP).
For example, ceramics base copper-clad laminates, in order to meet the high heat dissipation requirements brought about by high heat generation, it is recommended to add materials with good thermal conductivity (such as ceramic powder such as alumina and silica) to the selected dielectric materials. When conditions permit, it is best to use metal-based copper clad laminates (such as Aluminum base board) for PCB circuit boards in high-heating functional areas. The conductor layer is covered on the insulated aluminum base. The heat generated in the conductors in the board passes through the aluminum plate quickly. Communicate it to achieve efficient heat dissipation.