Rigid-Flex Board I/O Connectors

What is flexo module interconnection？

 With the development of high-tech electronic products, high density and high connection requirements, High frequency board and Rigid-Flex Board have been widely used.
The flexible board assembly is an interconnecting PCB assembly that uses a flexible printed board (FPC) as a carrier to transmit low-frequency, radio frequency (Microwave radio frequency board), power, and high-speed signals in a limited space and weight. The flexible board component changes the traditional rigid board plane design, and uses the three-dimensional three-dimensional space and structure to form a good conformal design. Compared with traditional cable assemblies, flexible board assemblies take into account the advantages of printed boards and cables, and PCB assembly is more integrated.

product description
The great advantages that flexographic components bring to product design and assembly:
Flexible board components can replace Cable Connectors I/O Connectors components connected by multiple Electronic connectors and Cable Connectors, saving space and greatly reducing the weight of the finished product.
The wiring work of the flex board components is mainly completed in the product design stage, which radically reduces the workload of on-site wiring, and the inside of the equipment is more concise and beautiful.
The flexible board assembly can be attached to the structure of the device well in the interior of the device. Compared with the cable, it has a large-span advantage in terms of electrical and environmental resistance, which improves the stability, reliability, and quality consistency of the device.
▼Flexible PCBA with macro connectors at both ends
▼Able to realize multi-branch shaped flexible PCBA
▼Flexible PCBA that realizes the interconnection of internal and external signals of the device
▼Flexible PCBA with lightning protection function
▼Flexible PCBA that can realize the function of penetrating the cabin
Performance
Working temperature: -55℃～125℃
Transmission rate: ≤10Gbps
Characteristic impedance: 100Ω±10%
Withstand voltage: >500V (25℃, 101.3kPa)
Insulation resistance: ≥100MΩ (25℃, 101.3kPa, 500VDC)
Bending radius: R≥10D (D is the thickness of the flexible board)