multi layer aluminum pcb

 What is Hybrid PCB?

 PCB surface treatment technology refers to the process of artificially forming a surface layer that is different from the mechanical, physical and chemical properties of the substrate on the Electronic Components and Electronic connectors on the PCB. Its purpose is to ensure good solderability or electrical performance of PCBA Manufacturing. Because copper tends to exist in the form of oxides in the air, which seriously affects the solderability and electrical properties of the PCB, it is necessary to perform surface treatment on the PCB.

The common surface treatment technologies in the industry mainly include
(1) Hot air leveling
(2) Chemically immersed nickel and gold;
(3) The whole plate is electroplated with nickel and gold;
(4) Organic coating (organic protective film);
(5) Chemical immersion silver;
(6) Chemical tin deposition.
Although these treatment methods are widely used, they all have their limitations. The tin surface leveled by hot air is not flat, which is not suitable for the HDI PCB mounting process. The cost of electroplating nickel and gold on the whole board is high, and the solderability is not good; chemical immersion silver has very strict environmental requirements and is easily oxidized by air sulfur and chemical precipitation Tin has a great attack on solder mask and can easily cause solder mask to fall off. Tin whiskers will grow within a few months after the Surface-Mount (SMT) & BGA Assembly; the organic coating (OSP) surface is flat and the soldering performance is strong, but not Wear-resistant, not suitable for HDI PCB products with button positions; poor strength of electroless nickel-gold solder, which is likely to cause cracks after welding at BGA. The use of hybrid surface treatment technology can learn from each other's strengths, integrate the advantages of various surface treatment technologies, and effectively solve these deficiencies.