
Picosecond laser marking machine
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$8000.00≥2500 Set/Sets
- Min. Order:
- 2500 Set/Sets
- Min. Order:
- 2500 Set/Sets
- Transportation:
- Ocean, Land, Express
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Incoterm: | FOB,CFR,CIF,EXW,FAS,CPT,FCA,CIP |
Transportation: | Ocean,Land,Express |
1. Good beam quality, small spot size, suitable for ultra-fine marking.
2. The heat affected zone is very small, avoiding the damage to the processing materials.
3. Fast marking speed, high efficiency and high precision.
4. No consumables, low cost of use and maintenance.
5. The performance of the machine is stable and suitable for long-term operation.
Application:
1. Cutting and drilling brittle materials such as glass, sapphire and ceramics.
2. LCD, OLED screen cutting (C, R, u angle cutting).
3. Super precise mark points, invisible QR code (0.2mm) and other fine marks on glass materials.
4. Metal medical equipment processing traceability mark, with anti etching, anti-oxidation and other functions
5. Cut, drill or remove surface coatings on plastics, oxides and organic materials.
Specification:
Machine model EP-IRPS-20
Laser wavelength 1064nm
laser power 20W / 10ps / 1000kHz
Repetition rate 1000KHz
Marking range 100*100mm
Marking line width ≤0.03mm
Marking depth ≤0.1mm
Minimum character 0.06mm
Marking speed ≤7000mm/s
Repeat positioning accuracy ± 0.01mm
Electricity demand AC 220V, 50Hz, 16A
Total power consumption ≤1.5kW
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