
Automatic UV laser marking machine
-
$10000.00≥2400 Set/Sets
- Min. Order:
- 2400 Set/Sets
- Min. Order:
- 2400 Set/Sets
- Transportation:
- Ocean, Land, Express
Your message must be between 20 to 2000 characters
Contact NowPayment Type: | L/C,T/T,D/P,D/A,Paypal |
---|---|
Incoterm: | FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP |
Transportation: | Ocean,Land,Express |
UV laser marking machine belongs to a series of products of laser marking machine, but it is developed by 355nm UV laser. The machine adopts third-order intracavity frequency doubling technology. Compared with infrared laser, 355 UV focused spot is very small, which can greatly reduce the mechanical deformation of materials, and the processing heat effect is small. It is mainly used for ultra-fine marking and carving, especially suitable for food and beverage It is widely used in many fields, such as marking of pharmaceutical packaging materials, micro hole marking, high-speed division of glass materials and complex pattern cutting of silicon wafer
characteristic:
1. It has good beam quality and small focusing spot, and can realize ultra-fine marking;
2. In addition to copper, the materials suitable for processing are more extensive, making up for the lack of infrared laser processing ability;
3. The heat affected area is very small, avoiding the damage of processed materials, and the yield is high;
4. Marking speed, high efficiency, high precision;
5. Stable performance, small size, low power consumption, long-term operation;
6. No need of consumables, low cost of use and maintenance;
7. High electro-optic conversion rate, long service life of nonlinear crystal, modular design, easy installation and maintenance;
8. It can be equipped with two-dimensional automatic workbench to realize multi position continuous marking or large format marking.
Application fields:
It is used for marking and surface treatment of various glass, TFT, LCD, plasma screen, textile, ceramic slice, monocrystalline silicon slice, IC grain, sapphire, polymer film and other materials.
technical parameter:
Model number |
UK-DBZ-FC20 |
UK-DBZ-FC30 |
UK-DBZ-FC50 |
Maximum laser power
|
20W |
30W |
50W |
Laser wavelength
|
1064nm |
1064nm |
1064nm |
Beam quality |
<1.5 |
<1.8 |
<2.0 |
Laser repetition frequency |
20KHz-80KHz |
20KHz-80KHz |
20KHz-80KHz |
Marking area |
100mm*100mm(Optional parts) |
100mm*100mm(Optional parts) |
100mm*100mm(Optional parts) |
Engraving depth |
0.4mm |
0.6mm |
1.0mm |
Engraving line speed
|
≤15000mm/s |
≤15000mm/s |
≤15000mm/s |
Minimum line width
|
0.05mm |
0.05mm |
0.05mm |
Minimum characters |
0.15mm |
0.15mm |
0.15mm |
Repeatability accuracy |
±0.002mm |
±0.002mm |
±0.002mm |
Power consumption |
500W |
600W |
1000W |
Input power |
220V/50Hz/3A |
220V/50Hz/3A |
220V/50Hz/3A |
Processed products
Related Keywords