Connector PPS/Peek new energy battery pack

Two materials commonly used for CMP fixation rings PPS and PEEK

 

CMP or chemical mechanical planarization is a polishing process used in semiconductor manufacturing. It is commonly used to polish silicon wafers after they have been etched and patterned into individual chips.The CMP process can also be used to remove excess photoresist from the surface of objects manufactured using photolithography.

 

The CMP process can be divided into three steps:

 

1. Polishing - A polishing pad is mounted to the polisher and the pads are attached to the sides of the polisher. The wafer is placed into the holder and then the holder is placed into the polishing machine. The machine starts and the pads begin to rotate and apply pressure to the wafer. The polishing solution containing abrasive particles (silica and/or alumina) is pushed at high speed through the channels on both sides of the pads and reaches the wafer, removing material from the front and back surfaces of the wafer until a flat surface is obtained.

 

2. Cleaning - Dirty pads are replaced with clean pads and rotation is stopped while lubricant is applied to both sides of each pad.

 

3. The CMP ring is critical in these processes. The quality of the material and the machining process determine the goodness of the product

 

 

Why are PPS and PEEK commonly used?

 

There are two types of retaining rings used in the polishing process, one is a metal retaining ring and the other is a plastic retaining ring. However, compared to plastic retaining rings, metal retaining rings have a high coefficient of friction and the surface is easily scratched, resulting in a short service life. In addition, metal rings can lead to severe particle generation, which can result in a degradation of wafer quality. As a result, more and more manufacturers have switched from metal to plastic rings (e.g. PPS or PEEK). Typically, PEEK large tubes are mostly used in the process due to their ease of machining. Currently, most polishing pastes are non-abrasive, but in some applications abrasives are still present and can cause serious damage to the plastic material.

 

PPS and PEEK are the most commonly used materials for CMP retaining rings. If you are concerned about cost, then PPS is another option. We can provide large PPS sheets to accommodate different sizes of CMP rings. They are ideal for this type of application because of the material properties: stiffness, excellent resistance to chemicals and temperatures (up to 85°C), hardness (up to 85 HRC) and fatigue resistance.

 

PPS and PEEK are the two most commonly used materials in CMP retaining rings. Both have excellent physical properties such as chemical and temperature resistance, low coefficient of friction, high hardness and low water absorption. However, they also have significant differences in mechanical properties

 

Both materials have some excellent properties that make them attractive:

 

1) Low coefficient of thermal expansion;

 

2) low modulus of elasticity;

 

3) good chemical resistance;

 

4) excellent wear resistance

 

5) excellent stiffness-to-weight ratio.