
TECASINT®6012 natural Unfilled Polyimide for Direct Forming
- Min. Order:
- 1 Kilogram
- Min. Order:
- 1 Kilogram
- Transportation:
- Ocean, Land, Air, Express
- Port:
- Shenzhen, Guangzhou, Hongkong
Quantity:
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Basic Info
Supply Ability: | 100 |
---|---|
Payment Type: | T/T,Paypal |
Incoterm: | FOB,CFR,CIF,EXW,DDP,DDU |
Transportation: | Ocean,Land,Air,Express |
Port: | Shenzhen,Guangzhou,Hongkong |
Product Description
Product Description
TECASINT 6012 natural Unfilled Polyimide for Direct Forming
TECASINT 6012 natural is a non-meltable and highly temperature-resistant polyimide. This product is the unfilled type of the 6000 series from Ensinger which, compared to other TECASINT materials, is processed exclusively in the direct forming process. Direct forming is a cost-effective way of producing serial parts that require tooling. The new polyimide TECASINT 6012 natural is therefore used for series components in large quantities that have to withstand extraordinary thermal and mechanical stress.
Due to its very good creep resistance, this PI polymer shows practically no tendency to creep compared to thermoplastics. Low outgassing in a vacuum and good chemical resistance, even to high-energy radiation, are further key features of this PI plastic. Due to the low thermal conductivity and the good electrical insulation, components made of TECASINT 6012 natural are perfectly suited for insulators subject to extreme stress in mechanical engineering, electrical engineering and for applications in semiconductor technology. For use in cryogenics, the polyimide TECASINT 6012 retains its good properties down to -273 °C.

Facts
Chemical designation
PI (Polyimide)
Colour
brown-beige
Density
1.35 g/cm3
Main Features
high thermal and mechanical capacity
very high thermal and oxidative resistance
low water absorption
high creep resistance
low outgassing
good chemical resistance
resistance against high energy radiation
sensitive to hydrolysis in higher thermal range
Target industries
semiconductor technology
electrical engineering
electronics
mechanical engineering
vacuum technology
cryogenic engineering
automotive industry
Related Keywords
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