Hony Engineering Plastics Limited
Hony Engineering Plastics Limited
TECAPAI CM XP530 black-green GLASS FIBER FILLED PAI
  • TECAPAI CM XP530 black-green GLASS FIBER FILLED PAI
TECAPAI CM XP530 black-green GLASS FIBER FILLED PAI

TECAPAI CM XP530 black-green GLASS FIBER FILLED PAI

Min. Order:
1 Kilogram
Min. Order:
1 Kilogram
Transportation:
Ocean, Air, Express, Land
Port:
Shenzhen, Guangzhou, Hongkong
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Supply Ability: 1000
Payment Type: T/T,Paypal
Incoterm: FOB,CFR,CIF,EXW,DDU
Transportation: Ocean,Air,Express,Land
Port: Shenzhen,Guangzhou,Hongkong
Product Description
Product Description

TECAPAI CM XP530 is a compression molded polyamide-imide material that is modified with 30% glass fiber filler. Produced using Solvay Torlon® plastic polymer, TECAPAI CM XP530 delivers a unique combination of properties and may be recognized as products commonly referred to in web searches as "torlon 5530". Machining Torlon requires experience. One of the distinctive characteristics of this glass filled PAI is improved machinability when compared to other PAI compression molded materials. Micro machining with fewer burs left behind than competitive materials is possible. TECAPAI CM XP530 has high strength and stiffness at elevated temperatures, a low CLTE, good dielectric properties, and excellent compressive strength, in addition to excellent chemical resistance.


Typical applications include test sockets in the semiconductor industry, as well as electrical connectors and insulators. Users in aerospace might be interested in this versatile PAI plastic for fasteners and housings, or for other structural components. Minimum order quantities as low as 1 piece adds to the versatility of this PAI product.


TECAPAI CM XP530 black-green – GLASS FIBER FILLED PAI


Advantages of TECAPAI CM XP530 black-green:


Electrically insulating

Excellent strength and stiffness

Excellent dimensional stability

Very good thermal stability

Excellent chemical resistance


Target industries:

Semiconductor technology

Aircraft and aerospace technology

Oil and gas industry

Chemical and refinery industry

Process engineering


FACTS

Chemical designation

PAI (Polyamide-imide)

Color

black

Density

1.61 g/cm3


MAIN FEATURES

electrically insulating

excellent strength and stiffness

excellent dimensional stability

very good thermal stability

excellent chemical resistance


TARGET INDUSTRIES

semiconductor technology

aircraft and aerospace technology

oil and gas industry

chemical and refinery industry

process engineering



MECHANICAL PROPERTIES VALUE UNIT CONDITION TEST METHOD
Tensile strength at break 16,700 psi ASTM D 638
Modulus of elasticity
(flexural test)
890,000 psi ASTM D 790
Elongation at break (tensile test) 3.2 % ASTM D 638
Flexural strength 25,000 psi ASTM D 790
Modulus of elasticity
(tensile test)
900,000 psi ASTM D 638
Compression strength 5,800 psi 1% strain ASTM D 695
Compression strength 30,000 psi 10% strain ASTM D 695
Compression modulus 550,000 psi ASTM D 695
Shore hardness 92 - D scale ASTM D 2240
Impact strength (Izod) 0.9 ftlbsin notched ASTM D 256


THERMAL PROPERTIES VALUE UNIT CONDITION TEST METHOD
Deflection temperature 515 F @ 264 psi ASTM D 648
Glass transition temperature 529 F ASTM D3418
Thermal expansion (CLTE) 1.76 *10^-5 in/in / degre range -40 °F to 302 °F ASTM E 831


ELECTRICAL PROPERTIES VALUE UNIT CONDITION TEST METHOD
Dielectric constant 3.8 - @ 1 MHz ASTM D 150
Dissipation factor 0.006 - @ 1 MHz ASTM D 150
Surface resistivity 1013 Ω/sq ASTM D 257
Dielectric strength 500 V/mil ASTM D 149



OTHER PROPERTIES VALUE UNIT CONDITION TEST METHOD
Flammability (UL94) V-0 - 3.2 mm -
Moisture absorption 0.2 % 24 hr immersion ASTM D 570
Moisture absorption 1.8 % saturation ASTM D 570

Send your message to this supplier

  • Ms. Tina

  • Enter between 20 to 4,000 characters.

Product Categories