PCBA-SMT

• Material:    FR4,CEM-1,CEM-3, High-Tg, Rogers..
• Copper Thickness:    1.6 mm
• Surface Finishing:     ENIG,Immersion Tin , Gold Finger..
• Board Thickness:     1.0 mm
• Certificate:    UL, ISO 9001, ISO 14001

Our assembly competence:
Stencil size/range: 736 × 736mm
Minimum IC pitch: 0.30mm
Maximum PCB size: 410 × 360mm
Minimum PCB thickness: 0.35mm
Minimum chip size: 0201 (0.2 × 0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size: 74 × 74mm
BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum)
Frequency of stencil cleaning: 1 time/5 to 10 pieces