Multilayer HDI Rigid-Flex PCB

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Incoterm:: FOB, CFR, CIF, EXW, FCA, CPT, CIP

Min. Order:: 1 Piece/Pieces

Min. Order:: 1 Piece/Pieces

Transportation:: Ocean, Air

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Basic Info

Place of Origin:	China
Productivity:	10000
Payment Type:	L/C,T/T,D/P,Paypal,Money Gram,Western Union
Incoterm:	FOB,CFR,CIF,EXW,FCA,CPT,CIP
Certificate:	ISO9001
Transportation:	Ocean,Air

Product Description

Jinghongyi PCB, manufacturer and supplier of high quality multilayer HDI rigid flexible circuit board in Shenzhen，China. Provide PCB prototype, Multilayer PCB, HDI PCB, impedance PCB, and PCB assembly services, etc. The surface treatment process includes: OSP, HASL, HASL Lead-Free (HASL LF), Immersion Gold(ENIG), Immersion Silver, Immersion Tin, Plated Gold, etc. Solder Mask ink: Green, Red, White, Black, Blue, Yellow, Orange, Purple, Gray.

Multilayer HDI Rigid-Flexible PCB

Multilayer HDI Rigid-Flexible PCB

HDI is the abbreviation of the high-density interconnector. It is a kind of printed circuit board (PCB) production technology. It uses micro blind buried hole technology to produce PCB with high density. HDI is a compact product designed for small capacity users.

On the premise that electronic products tend to be multi-functional and complex, the contact distance of integrated circuit components will be reduced, the speed of signal transmission will be relatively improved, followed by the increase of the number of wiring. These ultra-high requirements are difficult to achieve for single-sided PCB or double-sided PCB. As a result, the circuit board will move towards multi-layer, and because of the increasing number of signal lines, more power supply layer and ground plane are necessary means for design, which makes the multi-layer printed circuit board more common.

Multilayer HDI Rigid Flexible PCB

Multilayer HDI Rigid Flexible PCB

The combination of the multi-layer rigid-flexible circuit board and HDI can greatly improve the overall performance of the circuit board, and also can expand the scope of use of the circuit board. It not only increases the number of layers of the circuit board but also increases the density of the circuit distribution, improves the transmission speed of the signal and kills two birds with one stone.

For the electrical requirements of high-speed signals, the board must provide impedance control with AC characteristics, high-frequency transmission capability, and reduce unnecessary radiation (EMI). With the structure of Stripline and Microstrip, multi-layering becomes a necessary design. In order to reduce the quality of signal transmission, an insulating material with a low dielectric constant and a low attenuation rate is used. In order to meet the miniaturization and array of electronic components, the circuit board also continuously increases the density to meet the demand. The emergence of assembly methods such as BGA (Ball Grid Array), CSP (Chip Scale Package), and DCA (Direct Chip Attachment) has pushed printed circuit boards to an unprecedented high-density state.

Multilayer HDI Rigid Flex PCB

Multilayer HDI Rigid Flex PCB

Electronic design not only improves the performance of the whole machine but also reduces its size. From mobile phones to small portable products of Smart wearer, "small" is the eternal pursuit. High-density integration (HDI) technology can make the end product design more miniaturized and meet the higher standards of electronic performance and efficiency. HDI is widely used in mobile phones, digital cameras, MP3, MP4, notebook computers, automotive electronics, and other digital products, among which mobile phones are the most widely used. The HDI board is generally manufactured by the build-up method. The more the number of layers, the higher the technical level of the board. The common HDI board is basically one-time stacking, and the high-level HDI adopts two or more times stacking technology, and at the same time, advanced PCB technologies such as stacking holes, electroplating filling holes, laser direct drilling are used. High-level HDI board is mainly used in 3G mobile phones, advanced digital cameras, IC carrier boards, etc.

What is rational is actual and what is actual is rational - Georg Wilhelm Friedrich Hegel.

PCB is widely used in our household appliances, industrial production machinery and equipment. However, in general, PCB refers to rigid PCB. Although rigid PCB is the most widely used, but with different application scenarios and functional requirements, rigid-flexible Printed Circuit Board also emerged.

Rigid-flexible PCB has been widely used and developed, which is inseparable from its superior performance.

With the development of PCB design and production technology, there have been Double-sided rigid-flexible PCB, multi-layer rigid-flex PCB(3 Layer, 4 Layer, 5 Layer, 6 Layer, 8 Layer, 10 Layer, 12 Layer, 14 Layer), etc.

What's "Rigid-Flex PCB"?

Rigid-Flex circuit is made from a combination of a PI flex material sandwiched between FR4 epoxy or Polyimide rigid layers.

Rigid-Flex circuit boards are composed of a combination of rigid and flexible circuit boards that are permanently connected to one another.

Drilling and plating are processed throughout the sandwiched areas.

Flex-Rigid PCB is a good solution for dynamic application. The whole cost can be profitable and increase the reliability of the device.

Use of Rigid-Flex circuit boards can reduce the total cost of the final product.

Depending on the application, the complete Rigid-Flex circuit board may be manufactured either symmetrically with inward flexible layers, or asymmetrically with outward flexible layers

Three kinds of common rigid-flexible PCB

What makes Rigid-Flex Circuits different from Flex?

In a Rigid-Flex PCB, drilling and plating are processed through Rigid-Flex sandwiched areas.

In a flex PCB with rigid stiffener, no plating through rigid part.

Rigid-Flex is a complex assembly of Rigid parts and Flex parts. Rigid Part can be designed as a HDI product.

Multilayer Rigid-Flex Circuits Structure

Two or more conductive layers with either flexible or rigid insulation material as insulators between each one, outer layers may have covers or exposed pads.

Rigid-Flex has conductors on the rigid layers, which differentiates it from multilayers circuits with stiffeners. Plated through-holes extend through both rigid and flexible layers (with the exception of blind and buried vias).

Access holes or exposed pads without covers may be on either one or both sides; vias or interconnects can be fully covered for maximum insulation.

Stiffeners are optional.

Rigid-flexible PCB Instant Quote with fast delivery

Request quotes for Rigid-flexible printed circuit board prototypes

Rigid-flex printed circuit boards are PCB combining rigid and flexible board technologies.

A Rigid-flex PCB design improves the reliability of applications by reducing the amount of interconnect points. The less interconnection you have on a design, the stronger your circuit board is, ultimately lowering the final costs of your device or application.

JingHongYi PCB offers the best quality of single-sided, double-sided, or multi-layered Rigid-flex PCBs.

Why Rigid-flex PCB is widely used?

Due to the huge advantages of rigid-flexible PCB, it is widely used in the following products and industries:

Space requirements can be minimized by applying 3D
By removing the need for connectors and cables between the individual rigid parts the board size and overall system weight can be reduced.
By maximizing space, there is often a lower count in parts.
Less solder joints assure higher connection reliability.
Handling during assembly is easier in comparison with flexible boards.
Simplified PCB assembly processes.
Integrated ZIF contacts provide simple modular interfaces to the system environment.
Test conditions are simplified. A complete test prior to installation becomes possible.
Logistical and assembly costs are significantly reduced with Rigid-Flex boards.
It is possible to increase the complexity of mechanical designs, which also improves the degree of freedom for optimized housing solutions.

Rigid Flex PCB Design

Different applications determine the design idea of rigid-flexible PCB.

New product designs coupled with improved flex circuit technologies have introduced new design rules for rigid-flex PCBs.

When you design rigid-flex PCBs, think in terms of electromechanical factors that affect both the flex circuit and the rigid board.

Before we move onto the proper design of such a PCB, you must also keep certain factors in mind. Technology is always changing and evolving as the years go by; this means that people come up with new designs and methods of creating a Rigid Flex PCB are and will always be different, so there is no absolute way of making a rigid Flex PCB.

Moreover, depending on the application of the rigid flex and its purpose, the design and layout can be very different from the standard design, so keep in mind that the purpose of the PCB can significantly affect the design of the PCB.

The thickness of a Rigid Flex PCB is very subjective, as depending on the purpose of the build the difference can be minor or incredibly significant. The average board thickness for a rigid Flex PCB can be somewhere between 0.2mm and 0.4mm. 0.2mm is the average thickness of a single layer PCB circuit, and 0.4mm is the average thickness of a PCB with nearly 4 layers.

Rigid-Flexible Printed Circuit Board Layout

When rigid-flexible PCB design, the materials used and PCB assembly should also be considered.

Only when many factors are considered comprehensively to create a Rigid Flex PCB that is both durable and flexible. All of these methods combine to make an effective and efficient circuit board.

Rigid Flex PCB's Technology and manufacturing Process

The technology that most manufacturers use on a PCB differs depending on the manufacturer, type of PCB, and the efficiency of the PCB. The efficiency of the PCB is one of the unique attributes about a rigid flex`s PCB, as depending on the task of the PCB the technology that a designer uses can differ significantly.

The manufacturing process of every PCB starts with stacking various layers of metal and other circuit boards. This part of the process is called the stack up.

The stack up is the process of placing the layers for the rigid flex printed circuit board. Depending on the Rigid-flex circuit board the stack up can be of one, two, or four layer(s), and layers increase by the object`s application as well as its uses.

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HDI Rigid-Flexible PCB , HDI Rigid Flexible PCB , Multilayer Rigid-Flex HDI PCB