JingHongYi PCB (HK) Co., Limited
JingHongYi PCB (HK) Co., Limited
Rapid PCB prototyping services for 8 layer PCB
  • Rapid PCB prototyping services for 8 layer PCB
  • Rapid PCB prototyping services for 8 layer PCB
Rapid PCB prototyping services for 8 layer PCB
Rapid PCB prototyping services for 8 layer PCB

Rapid PCB prototyping services for 8 layer PCB

Payment Type:
L/C, T/T, D/P, Paypal, Money Gram, Western Union
Incoterm:
FOB, CFR, CIF, FCA, CPT
Min. Order:
1 Piece/Pieces
Min. Order:
1 Piece/Pieces
Transportation:
Ocean, Air
Quantity:

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Basic Info
Basic Info
Place of Origin: China
Productivity: 10000
Payment Type: L/C,T/T,D/P,Paypal,Money Gram,Western Union
Incoterm: FOB,CFR,CIF,FCA,CPT
Certificate: ISO9001
Transportation: Ocean,Air
Product Description
Product Description

Rapid PCB prototyping services for 8 layer PCB with high quality and low cost.


PCB prototype manufacturing is the most economical solution to reduce the irreversible problems of products after formal batch production, resulting in incalculable economic losses.

Jinghongyi PCB can produce single-sided PCB, 2-layer PCB, 4-layer PCB, 6-layer PCB, 8-layer PCB, 10-layer PCB and even more layers of multi-layer PCB prototype and small and medium-sized mass production for customers.

Among them, the manufacturing of 8-layer circuit boards is more complex, difficult and relatively high cost. However, we generate a lot of 8-layer circuit boards. Therefore, your 8-layer circuit boards should be manufactured by reliable and experienced manufacturers like us. Moreover, there is no minimum quantity limit here. We can start with 1pcs. Most importantly, we offer higher quality products and more reasonable prices. There are few PCB manufacturers in the world who think about customers like us.

We support a 24-hour, 48-hour, 72-hour rush to solve your urgent needs.



Three common 8-layer PCB stacking modes

1. The first 8-layer PCB stacking mode


This is not a good stacking method because of the poor electromagnetic absorption capacity and power impedance. Its structure is as follows:


Layer 1: Signal 1, Component Surface and Microstrip Line Layer

Layer 2: Signal 2, Internal microstrip alignment layer, better alignment layer (X direction)

Layer 3: Ground

Layer 4: Signal 3, Strip line layers, better line layers (Y direction)

Layer 5: Signal 4. Strip line alignment layer

Layer 6: Power

Layer 7: Signal 5, Internal microstrip alignment layer

Layer 8: Signal 6, Microstrip alignment layer

2. Another 8-layer PCB stacking method


Due to the addition of reference layer and good EMI performance, the impedance of each signal layer can be well controlled. Its structure is as follows:


Layer 1: Signal 1, Component Surface, Microstrip Line Layer, Good Line Layer

Layer 2: Ground, Grounding Layer, Better Absorption Ability of Electromagnetic Wave

Layer 3: Signal 2, Strip line layers, good line layers

Layer 4: Power, The power supply layer and the underlying stratum constitute excellent electromagnetic absorption

Layer 5: Ground, Grounding Layer

Layer 6: Signal 3, Strip line layers, good line layers

Layer 7: Power, Grounding layer, with large power supply impedance

Layer 8: Signal 4, Microstrip alignment layer, good alignment layer


3. The third 8-layer PCB stacking method is also the best one we recommend.


The multi-layer grounding reference plane is adopted in this stacking mode, so it has very good magnetic absorption capacity. The structure is as follows:


Layer 1: Signal 1, Component Surface, Microstrip Line Layer, Good Line Layer

Layer 2: Ground, Grounding Layer, Better Absorption Ability of Electromagnetic Wave

Layer 3: Signal 2,Strip line layers, good line layers

Layer 4: Power, The power supply layer and the underlying stratum constitute excellent electromagnetic absorption

Layer 5: Ground, Grounding Layer

Layer 6: Signal 3, Strip line layers, good line layers

Layer 7: Ground, Grounding Layer, Better Absorption Ability of Electromagnetic Wave

Layer 8: Signal 4, Microstrip alignment layer, good alignment layer

Of course, for choosing how to use several layers of boards and how to stack them, many factors should be considered, such as the number of signal networks on the circuit board, the density of components, the density of PIN, the frequency of signals, the size of boards and so on. We should consider these factors comprehensively. The more the number of signal networks, the greater the density of components, the greater the PIN density, and the higher the frequency of signals, the design of multi-layer board should be adopted as far as possible. In order to get good EMI performance, it is best to ensure that each signal layer has its own reference layer.


Sometimes we will encounter a term: false 8-layer PCB, which is not really an 8-layer PCB, but a 6-layer PCB. In order to meet the impedance and thickness requirements of the circuit board, the 6-layer PCB uses three core boards, and the number of 8-layer PCB core boards is the same, so it is called false 8-layer PCB. In addition, fake 8-layer PCB will cost more than conventional 6-layer PCB, so we suggest either accepting fake 8-layer PCB or changing 6-layer PCB to 8-layer PCB.


If you want more information, these two pages may help you: 8 Layer PCB Stackup Guidelines, 8 layer PCB manufacturing



8 Layer PCB manufacture Price

For ordinary graphics cards and motherboards, the use of 4-layer PCB can basically meet the needs, and the cost of 6-layer PCB is about twice that of 4-layer PCB. 8-layer PCB is four times that of 4-layer PCB. Therefore, the general customers use 4-layer PCB.

However, it is undeniable that this is to some extent a cost-saving way, but at the expense of product stability.

Because if we use 6 or 8-layer PCB, we can have enough wiring space and more consideration of ground wire and power supply. So, we don't need to be too strict with the tightness of wiring. In this way, the line width and electromagnetic interference between wires will be fully considered. The stability of the board is obviously better than that of the 4-layer printed circuit board. Of course, this can not be generalized, because different wiring engineers have different levels and abilities.



PCB prototype fabrication

8 Layer PCB Prototype fabrication8 Layer PCB Prototype manufacturing



Prototype PCB Manufacturing Capability


Learn more about JHY PCB by exploring the manufacturing capability of PCB Prototype below. We can do more than you can imagine. 

Item

Manufacturing Capability

Number of Layers

1 - 8layers

Order Quantity

5pcs - 100pcs

Laminate

FR-4 Standard

Maximum PCB Size(Length x Width)

600*1000mm

Board Dimensions tolerance

±0.1mm - ±0.3mm

Board Thickness

0.4mm - 4mm

Board Thickness Tolerance

±0.1mm - ±10%

Copper Thickness

1-6OZ

Min Tracing/Spacing

2mil/2mil

Solder Mask Color

Green, White, Blue, Black, Red, Yellow

Silkscreen Color

White, Black

Surface Finish

HASL, LF HASL, ENIG

Test

Flying probe, Testing Fixture



Why choose us?

  • Save money&time! Achieve peace of mind!
  • A professional and trustworthy PCB prototype manufacturer.
  • Fastest PCB Prototype.
  • One stop solution for various PCB&SMT Stencil.
  • Low cost for simple PCB.
  • Affordable price for high-tech PCB.
  • Minimum orders 1pcs.
  • 24-hour online customer service.
  • Professional PCB engineer for one-to-one service.
  • Shipment on time.
  • Guarantee good service and quality from PCB quotation to delivery.

Certification(UL:E466618, TS16949,  ISO9001.RoHS)

UL Certification
TS16949 Certification
SGS Certification



PCB Shipment

JHY PCB offers flexible shipping methods for our customers, you may choose from one of the methods below.

Shipment

 

JHY PCB 's Packing Way

  • Use one professional PCB vacuum bag, with desiccant inside. Vacuum compressed totally.
  • Paste label and RoHs mark. Use second vacuum bag to protect boards again, vacuum compressed, make sure no exception.
  • Microsection report and Tin testing board are put together with PCB in cartons.COC (Certificate of Conformity)  will be sent to customer by email in PDF.
  • Several layers of thick EPE(Expandable polyethylene) are filled fully in gaps between PCBs and cartons. The thickness of 1 layer EPE is 10mm.
  • Neutral Packing is adopted if no special requirements. Strong and thick cartons(Thickness:10mm,7 layers). Different sizes of cartons are designed to meet the demand of different PCB size. All package are within weight limit of cartons. For mass production order, no exceed 21kg per carton normally.
  • All cartons sealed with strong adhesive tape should be sealed twice so as to make them more durable.
  • Solid PP/PET strapping is used outside of cartons. 
  • Shipping mark, fragile mark and postcode label are all pasted clearly.


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