8 Layer 1+N+1 HDI PCB

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Payment Type:: L/C, T/T, D/P, Paypal, Money Gram, Western Union

Incoterm:: FOB, CFR, CIF, EXW, FCA, CPT, CIP

Min. Order:: 1 Piece/Pieces

Min. Order:: 1 Piece/Pieces

Transportation:: Ocean, Air

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Basic Info

Place of Origin:	China
Productivity:	10000
Payment Type:	L/C,T/T,D/P,Paypal,Money Gram,Western Union
Incoterm:	FOB,CFR,CIF,EXW,FCA,CPT,CIP
Certificate:	ISO9001
Transportation:	Ocean,Air

Product Description

Name: 8 Layer 1+N+1 HDI PCB Board

Material: FR-4

Layer: 8 Layer 1+N+ HDI

Color: Black, White

Finished Thickness: 0.8mm

Copper Thickness: inner: 1OZ, ourter: 0.5OZ

Surface Treatment: Immersion Gold+OSP

Min Trace / Space: 3mil/3mil

Min Hole: Mechanical hole 0.2mm, Laser hole 0.1mm

Application: Micro electronic products

Jinghongyi PCB is a Chinese PCB manufacturer specializing in the production and assembly of HDI PCB prototype and small and medium batch PCB. Our factory base has a broad experience producing HDI PCB boards for different market applications. We can produce all types and all kinds of stackup of HDI PCB for you. With advanced manufacturing technology, experienced engineers and skilled production workers, they are the reliable guarantee of your PCB quality.

The materials we use to produce HDI PCB include: FR4 standard, FR4 high performance, Halogen free FR4, Rogers

Surface finishes available OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers.

Our advantage: Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.

For more information about the HDI PCB and the production capacity of our HDI circuit board, please download the PDF file provided by us.

High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB).

HDI PCB Full Forms：

1+N+1, 2+N+2, 3+N+3, 4+N+4, Any Layer Interconnection

According to layer up different, currently DHI PCB board is divided into three basic types:

1+N+1, 2+N+2, Any Layer Interconnection

1) HDI PCB (1+N+1)

Features:

Suitable for BGA with lower I/O counts

Fine line, microvia and registration technologies capable of 0.4 mm ball pitch
Qualified material and surface treatment for Lead-free process
Excellent mounting stability and reliability
Copper filled via
Application: Cell phone, UMPC, MP3 Player, PMP, GPS, Memory Card

1+N+1 HDI PCB Structure:

2) HDI PCB (2+N+2)

Features:

Suitable for BGA with smaller ball pitch and higher I/O counts
Increase routing density in complicated design
Thin board capabilities
Lower Dk / Df material enables better signal transmission performance
Copper filled via
Application: Cell phone, PDA, UMPC, Portable game console, DSC, Camcorder

2+N+2-HDI-PCB-structure

3) ELIC (Every Layer Interconnection)

Features:

Every layer via structure maximizes design freedom
Copper filled via provides better reliability
Superior electrical characteristics
Cu bump and metal paste technologies for very thin board
Application: Cell phone, UMPC, MP3, PMP, GPS, Memory card.

Every Layer Interconnection Structure

The HDI circuit board has the following advantages:

lower costs
increase wiring density
is conducive to the use of advanced packaging technology
have better electrical performance and signal accuracy
reliability is better
can improve the thermal properties
can improve radio frequency interference, electromagnetic wave interference, electrostatic discharge
increase design efficiency

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Related Keywords

HDI Double Sided PCB , HDI Board PCB , HDI Digital PCB