
3.0 IDC 19P Male Right Angle Dip Type
- Payment Type:
- T/T, Paypal, Western Union
- Incoterm:
- FOB, CIF, EXW
- Min. Order:
- 1000 Bag/Bags
- Min. Order:
- 1000 Bag/Bags
- Delivery Time:
- 12 Days
- Transportation:
- Ocean, Air
- Port:
- SHENZHEN, SHENZHEN
Your message must be between 20 to 2000 characters
Contact NowPlace of Origin: | China |
---|---|
Productivity: | 100KKPCS/Month |
Supply Ability: | 100KKPCS/Month |
Payment Type: | T/T,Paypal,Western Union |
Incoterm: | FOB,CIF,EXW |
Certificate: | ISO9001-2015 |
HS Code: | 853609000 |
Transportation: | Ocean,Air |
Port: | SHENZHEN,SHENZHEN |
Manufacturer :ANTENK ELECTRONICS.,CO LTD.
High quality, competitive price, fast delivery, quick reply. CE, Rohs, Reach passed.
USB 3.0 is the third major version of the Universal Serial Bus (USB) standard for interfacing computers and electronic devices. Among other improvements, USB 3.0 adds the new transfer rate referred to as SuperSpeed USB (SS) that can transfer data at up to 5 Gbit/s (625 MB/s), which is about 10 times faster than the USB 2.0 standard. It is recommended that manufacturers distinguish USB 3.0 connectors from their USB 2.0 counterparts by using blue color for the Standard-A receptacles and plugs,and by the initials SS.
USB 3.1, released in July 2013, is the successor standard that replaces the USB 3.0 standard. USB 3.1 preserves the existing SuperSpeed transfer rate, giving it the new label USB 3.1 Gen 1,while defining a new SuperSpeed+ transfer mode, called USB 3.1 Gen 2 which can transfer data at up to 10 Gbit/s over the existing USB-type-A and USB-Cconnectors (1250 MB/s, twice the rate of USB 3.0)
Contact current Rating:
0.5 Amperes per pin minimum for signals.
1.5 Amperes per pin minimum for VBUS
Dielectric Withstanding Voltage:AC 100V(RMS)
Insulation resistance:100Megohms Minimum.
Contact Resistance:
Initial:3OmΩ Max for mated connector
final(after stress)5OmΩMax
Mechanical Characteristics:
Mating Force:35 Newtoms.Maximum
Unmating Force:15 Newtoms.Mlnimum.
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