Shielded Top Entrance SMT 8P RJ45

MATERIAL:

   1.HOUSING MATERIAL:GLASS FILLED POLYESTER UL94V-0.
   2.CONTACT MATERIAL:PHOSPHOR BRONZE t=0.35mm
   3.PLATING:SELECTING GOLD PLATING                                  
     1u"~50u"OVER NICKEL IN CONTACT AREA.
    "TIN  PLATING VER NICKEL IN SOLDER AREA.
   4.SHIELD:0.25mm THICKNESS COPPER ALLY WITH NICKEL .PLATEL 
ELECTRICAL:
   1.VOLTAGE PATING:125 VAC RMS.
   2.CURRENT PATING:1.5 AMP
   3.CONTACT RESISTANCE:35  MILLIOHMS MAX 
   4.INSULATION RESISTANCE:1000 MEGOHMS MIN @ 500V DC.
   5.DIELECTRIC WITHSTANDING RESISTANCE: 1000V AC RMS 60Hz.1MIN
MECHANICAL:
   1.DURRABILITY:750 CYCLES MIN
   2.PCB RETENTION PRE-SOLDER :10LB MIN
ENVIRONMENTAL:
   1.STORAGE:-40℃ TO +85℃ .
   2.OPERATION:-40℃ TO +85℃ .
   3.IR REFLOW SOLDERING TEMPERRATURE:255~265℃(5~10 
     SECONDS)MATES WITH MODULAR PLUG CONFORMING TO FCC PART 68 SUBPART F.