
2.00mm Right Angle DIP PAD Wafer
-
$500.00≥1000 Piece/Pieces
- Min. Order:
- 1000 Piece/Pieces
- Min. Order:
- 1000 Piece/Pieces
- Transportation:
- Ocean, Air, Express
- Port:
- Shenzhen
Quantity:
Your message must be between 20 to 2000 characters
Contact NowBasic Info
Basic Info
Place of Origin: | China |
---|---|
Productivity: | 2000K/month |
Supply Ability: | 2000K/month |
Payment Type: | T/T,Paypal,L/C |
Incoterm: | FOB,CIF,EXW,FCA |
Certificate: | ISO9001 |
HS Code: | 8536909000 |
Transportation: | Ocean,Air,Express |
Port: | Shenzhen |
Product Description
Product Description
2.00mm Right Angle DIP Wafer PAD
Specifications:
·Current Rating:3A AC.DC
·Voltage Rating:100V AC.DC
·Withstanding Voltage:800V AC/minute
·Insulation Resistance:1000MΩ Min
·Contact Resistance:10mΩMax
·After Environmental Testing:≤20mΩ
·Temperature Range:-25°C-+85°C
Wafer
·Material:PA66,UL94V-0
·Material PIN:Brass TIN Plated

·Current Rating:3A AC.DC
·Voltage Rating:100V AC.DC
·Withstanding Voltage:800V AC/minute
·Insulation Resistance:1000MΩ Min
·Contact Resistance:10mΩMax
·After Environmental Testing:≤20mΩ
·Temperature Range:-25°C-+85°C
Wafer
·Material:PA66,UL94V-0
·Material PIN:Brass TIN Plated

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