3W IR 1050nm High Power LED 2835 SMT

1050nm Infrared LED with 2835 SMD LED;

Because the heat sink on the bottom and that can easy to dispatch the extra heat, 2835 SMD LED can handle higher operation. So that we can easy to put the high power IR LED chip inside of this SMD LED case. 2835FIRC105L42I1A is a IR LED with wavelength in 1050nm and packaged with 2835 SMD LED case. This small SMT LED case will make this 1050nm LED high power type easy to fit with different kinds of PCB board. But if this size are too small for you, we can also make it with 5050 case, 3535 SMD LED or 8mm diameter LED case. Just contact us for more detail about this IR LED. 

High power LED 2835 SMD LED Size: 

* High power SMD LED are also available in 940nm LED, 850nm LED, 730nm LED and some far red infrared LED *

Electrical Parameters:

*Pulse forward current confition: Duty 1% and Pulse width=10us.

*Soldering confition: Soldering confition must be completed with 3 secongds at 260℃

*Luminous intensity is measured by ZWL600.

*λD is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.

Production of SMD LED 2835 LED:

HANDLING PRECAUTIONS:

Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible Althouth its characteristiec significantly reduces thermal stress, it is more susceptible to damage by extemal mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated Led products. Failure to comply might lead to damage and premature failure of the led

1. Handle the component along the side surfaces by using forceps or appropriate tools.

2, Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.

3, Do not stack together assembled PCBS containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry.

4, 4-A The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks;

    4-B A plible material is suggested for the nozzle tip to avoid acratching or damaging the LED surface during pickup.

    4-C The dimension of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production;

    4-D As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plationg of leadframe. Special care should be taken if an LED with silicone encapsulation is to used near such substances.

5, Please aviod continued exposure to the condensing moisture environment and keep the product away from repid transitions in ambiemt temperature.

6, Product in the original sealed package is recommended to be assembled within 24 hours of opening.