
Bi-color 3528 SMD LED 940nm + 630nm SMT
- Min. Order:
- 5000 Piece/Pieces
- Min. Order:
- 5000 Piece/Pieces
- Transportation:
- Ocean, Land, Air
- Port:
- SHENZHEN
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Contact NowPlace of Origin: | China |
---|---|
Productivity: | 1000000000 pcs/week |
Supply Ability: | 7000000000 pcs/week |
Payment Type: | T/T,Paypal |
Incoterm: | FOB,EXW,FCA |
Certificate: | GB/T19001-2008/ISO9001:2008 |
HS Code: | 8541401000 |
Transportation: | Ocean,Land,Air |
Port: | SHENZHEN |
3528 SMD LED Case with Red and infrared Bi-color LED ;
In this 3528FR63IR94C LED, we produce it 630nm LED and 940nm LED together in same 3528 SMD LED case. Which will be more easy to control in the PCB board. There have kinds of 3528 SMD LED such as: PLCC2 3528 LED, PLCC4 3528 LED and even 3528 PLCC6 LED. Normally we will put one chip into the 3528 PLCC2 LED, which make this SMD LED just be single color LED. And then we put two chips into 3528 PLCC4 LED case, then this LED will be bi-color LED(or we can also just put two same chips inside make it with higher power single color LED) or we can put three chips inside to make it with tri-color LED. For 3528 PLCC6 LED, we will be able to put 3 chips LED, such as 3528 RGB LED, 3528 RYG LED ect. If you need some bi-color LED that meets your project, just feel free to contact us for more detail about it~
Bi-color 3528 SMD LED Size:
*This SMD LED package are also available in other wavelength like 850nm LED, 730nm LED, 520nm LED, Yellow LED ect. *
Absolute Maximum Ratings(Tc=25℃)
Parameter
Symbol
Rating
Unit
630nm
940nm
Power Dissipation
Pd
70
170
mW
Pulse forward current
IFP
100
500
mA
Forward current
IF
≤30
≤100
mA
Reverse voltage
VR
5
V
Junction temperature
Tj
100
℃
Operating Temperature
Topr
-40 ~ +80
℃
Storage Temperature Range
Tstg
-40 ~ +100
℃
Soldering Temperature
Tsol
240
℃
Electro-static-discharge(HBM)
ESD
2000
V
Service life under normal conditions
Time
50000
H
Warranty
Time
2
Years
Antistatic bag
Piece
2000pcs
Bag
*Pulse forward current condition: Duty 1% and pulse width=10us.
*Solering condition: Soldering condition must be completed with 3 seconds at 260℃
Electrial Optical Characteristics(Tc=25℃)
Parameter
Symbol
Min
Typ
Max
Unit
Test Condition
Forward voltage
630nm
VF
1.5
1.7
1.9
V
IF=20mA
940nm
1.3
1.6
1.7
IF=20mA
Luminous intensity
630nm
IV
400
600
mcd
IF=20mA
940nm
20
30
mw
IF=20mA
Peak wavelength
630nm
λP
630
633
635
nm
IF=20mA
940nm
940
950
960
IF=20mA
Half width
△λ
15
nm
IF=20mA
Viewing half angle
2θ1/2
120
deg
IF=20mA
Reverse current
IR
5
uA
VR=5
*Luminous intensity is measured by ZWL600.
*θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
HANDLING PRECAUTIONS:
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible Althouth its characteristiec significantly reduces thermal stress, it is more susceptible to damage by extemal mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated Led products. Failure to comply might lead to damage and premature failure of the led
1. Handle the component along the side surfaces by using forceps or appropriate tools.

2, Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.

3, Do not stack together assembled PCBS containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry.

4, 4-A The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks;
4-B A plible material is suggested for the nozzle tip to avoid acratching or damaging the LED surface during pickup.
4-C The dimension of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production;
4-D As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plationg of leadframe. Special care should be taken if an LED with silicone encapsulation is to used near such substances.

5, Please aviod continued exposure to the condensing moisture environment and keep the product away from repid transitions in ambiemt temperature.
6, Product in the original sealed package is recommended to be assembled within 24 hours of opening.

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