Multilayer R-F circuit with edge plating

Multilayer rigid-flex circuit board with edge plating, FR4 TG150 + PI material. ENIG surface treatment. Inner and outer copper thickness are both 1oz. Total board thickness is 1.2 mm. unit size is 12*102 mm. Panel size is 92*126 mm. 5-UP without x-out. Min.line width/line spacing is 0.13/0.13 mm. Edge plating needed.   

We can do kinds of special techniques, including edge plating, half hole milling, resin filling, countersunk hole, milling depth control. impedance control, Local hard gold plating, etc.

We continue to introduce advanced equipment and improve our workers' skills. Now we are able to fully produce 1-12 layers flexible and rigid-flexible boards.