HDI printed circuit board

12 layer HDI printed circuit board. Base Material: FR4 TG180.  inner copper thickness 1/0.5oz and outer copper thickness 1 oz finished. surface treatment Immersion Gold 2U". With green colour solder mask. Board thickness 1.2 mm. Min.track/Min spacing 0.75/0.75 mm. single board with four 5mm rails aroud. Routed and v-cut. 100% AOI and 100% E-test pass.  L1-L2, L1-L3 laser drill. All micro drill to be filled and copper cap. the distance between BGA PIN spacing only 0.4 mm. With 50+/-5 ohm Single-terminal impedance and 100+/-10% ohm differential impedance control.