heat sinking laser cutting alumina ceramic substrate chip

heat sinking laser cutting alumina ceramic substrate chip

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Alumina Ceramics:

The ceramic substrate refers to a special process plate in which a copper foil is directly bonded to a surface of an alumina (Al 2 O 3 ) or aluminum nitride (AlN) ceramic substrate (single or double sided) at a high temperature. The ultra-thin composite substrate produced has excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current carrying current. ability. Therefore, ceramic substrates have become the basic material for high-power power electronic circuit structure technology and interconnection technology. 

◆ Strong mechanical stress, stable shape; high strength, high thermal conductivity, high insulation; strong bonding, anti-corrosion.
◆ Better thermal cycle performance, the number of cycles is up to 50,000 times, and the reliability is high.
◆It can etch various graphic structures like PCB board (or IMS substrate); it is non-polluting and pollution-free.
◆The use temperature is wide -55 °C ~ 850 °C; the thermal expansion coefficient is close to silicon, simplifying the production process of power modules.

High hardness, high strength, wear resistance, corrosion resistance, high temperacture (1600°), good thermal diffusivity, good insulativity, low cost etc. 

Data Sheet↓

Thermal Shock Resistance: 200 △T°C

Maximum use temperature 1650°C

Dielectric Strength: ＞10 KV/mm

Dielectric Constant: 9.1er

Dielectric Loss Angle(1MHz): 0.0002-0.0003

Volume Resistivity(20°C): ＞1014Ω.cm

7.MOQ is not limited, small quantity is welcome.

8.Vigorous team and good after-sales service

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A: Yes, we could offer the sample for free charge but do not pay the cost of freight.
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