Bingri Electronic Technology (Shenzhen) Co., Ltd.
Bingri Electronic Technology (Shenzhen) Co., Ltd.
LED Package 3525uvc Curing Lamp Wholesale On Sale
  • LED Package 3525uvc Curing Lamp Wholesale On Sale
LED Package 3525uvc Curing Lamp Wholesale On Sale

LED Package 3525uvc Curing Lamp Wholesale On Sale

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Basic Info
Basic Info
Place of Origin: China
Payment Type: T/T
Incoterm: FOB
Certificate: ISO9001;IATF16949
Transportation: Air
Product Description
Product Description


                                                     LED Package 3525uvc Curing Lamp Wholesale On Sale

We use regular brand chips, factory direct sales, trustworthy. The new era of LED energy saving and environmental protection, 3535 SMD lamp beads. Stable performance, long life, strong light efficiency, long life, stable output, high light efficiency and low light decay. Beautiful colors, even lighting, a variety of colors. High heat dissipation, low energy consumption, natural light.




  • Features


       * Emitted Color: UVC 

        * Lens Appearance: Clean quartz lens

        * Dimensions:3.5*3.5mm 
        * Power
:25-30mW 
        * Optical Angle
:60 degree
        * Current
:150mA 
        * Voltage
:6.5V 
        * Wavelengths: 270-280nm 

  • Applications

        1.Sterilize



  • Soldering:



        1. Manual Soldering
        The temperature of the iron tip should not be higher than 350℃and Soldering time to be within 3 seconds per
        solder-pad.
        2. Reflow Soldering
        Preheating : 140℃~160℃±5℃,within 2 minutes.
        Operation heating : 260℃(Max.) within 10 seconds.(Max)

        Gradual Cooling (Avoid quenching)

huiliuhang



  • Storage



        In order to avoid the absorption of moisture, it is recommended to solder BINGRI LEDs as soon as possible after
        unpacking the sealed envelope.
        If the envelope is still packed, to store it in the environment as following:
          (1)Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
          (2)After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent
              soldering process must be:
              a. Completed within 168 hours.
              b. Stored at less than 30% RH.
        (3)Devices require baking before mounting, if:
             (2) a or (2) b is not met.
        (4)If baking is required, devices must be baked under below conditions:
               48 hours at 60℃±3℃





  • Tapping and packaging specifications (Units: mm)


Tapping and packaging specifications





* Widely used in surface sterilization,air sterilization,water sterilization,and has a high usage rate in biomedicine.


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