Hemeixin Electronics Co.,Ltd.
Hemeixin Electronics Co.,Ltd.
rigid flex PCB Prototype fabrication
  • rigid flex PCB Prototype fabrication
rigid flex PCB Prototype fabrication

rigid flex PCB Prototype fabrication

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Basic Info
Basic Info
Product Description
Product Description

RFPCB's are products using a combination of flexible and rigid board technologies in one application. Depending upon the design of the application, rigid flex PCB's typically consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.


Rigid-flex circuits


Hemeixinpcb offers a full range of rigid board constructions from single / double sided upwards, but it also support laser drilled microvias, cavity boards, heavy copper up to 30 oz., via-in-pad, microwave & RF boards, up to 58 layers and others.  

  • High layer count multilayer rigid
  • Thermal and signal integrity management solutions, employing coins and cavities
  • FR4 / Polyimide / High Speed / Special Materials
  • Hybrid solutions for Microwave/RF applications
  • HDI Micro via– blind, buried, staggered & stacked vias
  • Microvias filled by epoxy and copper capped
  • Quick turn support
  • Thermal management
  • Heavy copper
  • Controlled Impedance
  • Large format PCB


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