Micro BGA PCB Assembly

our strengths lie in our ability to achieve the lowest cost possible, the highest level of quality and a service level second to none. We remain on the cutting edge of technology by continually investing in new hardware and have a strong reputation for delivering quality products using all manner of electronic assembly and Micro BGA PCB Assembly processes including 01005 components, fine pitch and high count BGAs, Package on Package (POP), Chip on Board, fiber optics, RF microelectronics, press fit connectors ect.

We provide a safe and supportive work environment as well as career development for our employees. We advocate work life balance through the values of wellness and happiness.

In addition to volunteer work to show respect and dignity to people in the communities in which we operate in, Hemeixin is committed to protecting our planet`s environment to minimize pollution and damage. We are devoted to developing capabilities that allow green manufacturing and product design in an environmental friendly manner.