Prototype Flex-rigid circuits fabrication

Hemeixinpcb specializes in high reliability flex and rigid-flex circuits for Medical Device, Medical Implant, Diagnostic Ultrasound, Telecommunications and Patient Monitoring applications. Manufacturing Flex-rigid circuits including adhesiveless construction for thinner and more flexible circuits and Rigid-Flex Circuits maximize three-dimensional space and support higher component density and leadless SMT packages

Consumers' escalating demand for more features in their small and mobile electronics products, such as PDAs and cell phones, is driving a need for smaller feature sizes, process geometries, and pc boards. For engineers dealing with these desires, the need for HDI (high-density-interconnect) technology has become a reality. HemeixinPCB describes HDI technology as a process that lets you produce a pc-board with through-hole, blind, or buried vias of less than 0.006 in. in diameter without using conventional drilling technology. Users of HDI technology must be able not only to assess and implement next-generation technology, but also to understand its boundaries in terms of layer stack up, via and microvia formation, feature size, and the primary differences between it and traditional pc-board technologies.