Backplane PCB Prototype fabrication

We offer a complete solution for backplane fabrication and backplane PCB assembly from our cost-competitive manufacturing facility in China. We can build all types and sizes of backplanes, including some of the largest and most sophisticated back-panels in the world.

Owing to significantly increasing transmission frequencies, i.e. shorter pulse rise times of electronic components, in high frequency technology, it has become necessary to treat the conductors concerned as a

component. Depending upon a number of parameters, HF signals are reflected on circuit boards. This means that the characteristic impedance differs from the output impedance of the transmitting component. The proper transmission of the signal is thus no longer guaranteed.

HemeixinPCB has created the option of checking the required impedance on the customer's circuit board, so as to modify the circuit board, or the tracks and the layer structure if necessary. The impedance is largely determined by the track geometry, the structure of the layers and the dielectric constant (Er) of the materials used.

After making the circuit board, the impedances are checked and recorded. The results of the measurements are available on request at any time.