Full Auto RFID Flip Chip Assembling Machine

YMJ-WB-30K is a device designed for the RFID industry of IOT, electronic tag HF, UHF chip patch.

This machine suitable for the antenna with a wide width of 20-180mm and the whole line is automatic loading, automatic material pulling, automatic glue dispensing, placement chip, automatic hot pressing, automatic detection mark and automatic unloading. It supports 8-inch and 12-inch wafer plate. The patch part uses three sets of cameras to align the material and the chip to meet the chip placement accuracy requirements.

Using industrial computer control, with imported stepping motor, cylinder, guide rail, screw and other structural framework, to meet the customer's long-term use of equipment stability requirements; And the hot-pressing mechanism adopts 64 sets of hot-pressing heads. Each set of hot-pressing heads ensures the flatness and the adjustment of hot-pressing pressure and temperature of each set is consistent and stable to ensure the curing effect of glue.

Technical parameters

UPH: 25k~40k pcs/h(Depend on different materials)

Patch accuracy: ±20um

Roll material width: 20~180mm

Outer diameter of core: max. 600mm

Chip: 0.2mm x 0.2mm ~2mm x 2mm

Chip input: 8-inch Wafer .12-inch Wafer

Wafer expander:Manually wafer expander

Visual system: 7 set CCD visual system( Location vision.detection vision)

Control:PC

Power supply:220VAC

Weight:3000KG

Overall dimension:about  L5600mm * W1300mm(Not include display) * H1700mm