Dual Interface Card Milling and Embedding Two in One Machine

Dual interface card embedding machine used for conductive glue, tin paste, conductive glue tape, contact IC and coupling IC technology. Machine includes milling, suction cleaning, glue dispensing, pre-welding, module punching, embedding, OCR checking and bad card separate collecting functions.

Technical parameter:

Control:Industrial PC  

Voltage:AC 380V  50 / 60 Hz 20A

Power:12 KW

Air Pressure:6㎏/C㎡

Speed:For DI card with tin technology is about 2500-2800cards/h

For DI card with conductive glue technology is about 3200 cards/h.

For normal card is about 4000 cards/h.

Dimension:(L)4220*(W)950*(H)1910 mm

Weight:3000kg

Module punching accuracy:+/-0.05mm

Milling position accuracy:+/-0.05mm

Milling depth:±0.015~±0.02mm

Milling size:±0.05mm

Embedding position accuracy:+/-0.05mm

Embedding Flatness accuracy:+0.05mm, -0.1mm

Embedding Head Temperature adjustment range:25℃~300℃

The temperature difference between the actual temperature of the welding head and the display temperature of the equipment are:Less than10℃

Temperature fluctuation range:+/-10℃

Applicable materials:Hot melt glue tape, Laminated strip module with ISO standard, 0.68~0.8mm thickness ISO lamination PVC, ABS card.

Operator:1 person

Pass Rate:99.8%

Equipped with machine:Vacuum Cleaner (one set)      Chiller (one set)