TAB/FOB Bonding Machine XCM71-A6

Application:

1. The machine is used for bonding variety of FPC, COF, TAB to LCD PANEL and PCB.

2. Widely used in large-size LCD screen repair bonding, touch screen repair bonding, production bonding and other fields.

Features:

1. Double pressure control can satisfy 2 kinds of processes which are FOG and FOB.

2. Group of double cylinders can eliminate gravity of pressure head and improve precision.

3. Pressure head can be adjusted in one-way independently.

4. Platform is adopted high level guide rail and sliding blocks to ensure precision.

5. LED light source can be adjusted according to different requirement of matter.

6. Video segmentation can satisfy different time magnification.

7. Locating valve ensure precision of bonding position and can fix different products efficiently.

8. Infrared ray help to find position of bonding (COF and PCB) more promptly.

9. Collector of silicone rubber can avoid friction of cutting head when the bonding is not working. However, when bonding is working, silicone rubber can fully touch cutting head.

10. Permanent position ensures to frequently replace cutting head in same way.

11. Pre-press manual valve help pressure head movable during adjustment.

12. Camera adjusts through XYZ precision sliding table that improve efficiency.

13. Servo motor drives LCD platform that can precisely move to bonding position, especially for production and a big amount of products.

14. Independent vacuum pump can save pressure and ensure attaching more tightly.

15. Movable rod easily operate.

16. Pulse heating divided into different area to fix different temperature.

17. According to different product`s size, you can select different vacuum area from LCD platform.

18. The machine can set, storage and recall a number of position parameters, time parameters, speed parameters and so on.

Basic Parameter:

Input Power: AC220V 50-60Hz

Group of Pressure Head: Single pressure head and double cylinders

Rated Power: 2-4 KW

LCD Platform: Movable Bakelite Plate

Working Pressure: 0.4-0.8 Mpa

Controlling Program: LG/PLC

Sized of Pressure Head: 100*5mm (can be customized)

Dimension: L2810*W1735*H1680mm

Method of Heating: Constant/Pulse Heating (optional)

Construction of Machine: All-in-one

Available Size: within 85 inches (can be customized)

Visual System: Camera bottom/top alignment (optional), 7 inches display

Accessories:

Sensitive paper, Anisotropic Conductive Film, Silicone rubber, ACF remover

Dust-free cloth, Ethanol, Cotton swabs

Tools:

Tweezers, COF Removing Machine, Cutter, Hot Air Gun