
High Speed Design Multi Layers 8 layer Electronic board FR4 metal detector PCB
- Payment Type:
- T/T, Paypal, Western Union
- Incoterm:
- FOB, CIF
- Min. Order:
- 1 Piece/Pieces
- Min. Order:
- 1 Piece/Pieces
- Delivery Time:
- 10 Days
- Transportation:
- Air
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Contact NowPayment Type: | T/T,Paypal,Western Union |
---|---|
Incoterm: | FOB,CIF |
Transportation: | Air |
High Speed Design Multi Layers 8 layer Electronic board FR4 metal detector PCB
Quick detail:
Material:FR4 |
Soldermask:Green |
Molde Number:ONE-6 |
Silkscreen:White |
Layer:8 |
Panel Size:98*75mm |
Board Thickness:1.0mm |
Package Details: Inner:Vacuum-packed Bubble bag With Foam Outer:Carton Box |
Min Line Space:7Mil |
|
Min Line Width:7Mil |
|
Min Hole Size:15Mil |
|
Finished Surface:ENIG |
Special requirement: Impedance Control in 50Ohms Resin Hole Provide Slice report |
Finished Copper:1oz |
|
Delivery Time:8 Days |
With these top technology,we can meet all your requirements,such as 24 hours quick sample service,rogers&fr4 mixed compression,4-28 multilayer lamination,crossed blind buried vias hole and so on.
Any inquiry can feel free to send us to check if we are able to manufacture your boards.We have professional engineer with more than 10 years pcb working experience can understand all your detail requirements whatever Chinese or English.
A printed circuit board substrate commonly used: 1, hard board: XPC, FR-1, FR-2, CEM-1, CEM-3,22F, FR-4, Rogers (Rogers), a metal board (including aluminum substrate, copper substrate), a ceramic plate or the like;
2, FPC: polyimide (polyimide), Polyester (polyester) or the like.the commonly used FR-4 CCL comprises the following sections:
A.the glass fiber cloth
B.epoxy resin
C.copper
D.the filler (or special requirements for high-performance sheet)
Company Service:
24 hours quick sample is avaliable here.
reply Customer's any enquiry within 3 hours;
Blind buried hole ,crossed blind hole can be done
24 hours Engineering Gerber files treatment.
24 hours English Engineering Questions Confirmation by E-mail.
Supply the best project fit for production customized
Specification:
High Speed Design Multi Layers 8 layer Electronic board FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.
The mechanical properties of epoxy glass fiber cloth substrate, size stability, impact resistance, moisture resistant to higher than paper substrate. Its excellent electrical performance, high working temperature, itself performance affected by environment. On the processing technology, than other resin fiberglass cloth substrate has great superiority
Radio frequency (RF) and microwave PCB`s are a type of PCB designed to operate on signals in the megahertz to gigahertz frequency ranges (medium frequency to extremely high frequency). These frequency ranges are used for communication signals in everything from cellphones to military radars. The materials used to construct these PCB`s are advanced composites with very specific characteristics for dielectric constant (Er), loss tangent, and CTE (co-efficient of thermal expansion).
High frequency circuit materials with a low stable Er and loss tangent allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same Stack-Up for optimal performance and economics.
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable
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