Fr4 Processing Parts For Electronic Switch Mold
- Min. Order:
- 100 Kilogram
- Min. Order:
- 100 Kilogram
- Transportation:
- Ocean, Land, Air, Express
- Port:
- Shenzhen, Guangzhou
Quantity:
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Basic Info
| Place of Origin: | China |
|---|---|
| Productivity: | 100tons/month |
| Supply Ability: | 100tons/month |
| Payment Type: | T/T,D/P,D/A |
| Incoterm: | FOB,CFR,CIF,EXW,FAS,FCA,DDP,DDU |
| Certificate: | ISO9001 |
| Transportation: | Ocean,Land,Air,Express |
| Port: | Shenzhen,Guangzhou |
Product Description
Product Description
Ingredients
Base material: Glass fiber cloth (electronic grade) is used as a reinforcing material to provide mechanical strength and structural stability.
Resin system: A combination of epoxy resin and hardener is used. Some formulas contain brominated epoxy resin to achieve flame retardant properties.
Additional components: Some products add fillers (such as inorganic substances) to optimize dielectric properties or thermal stability
Performance characteristics
Mechanical properties:
High rigidity, tensile strength (up to 150MPa or more at room temperature) and compressive strength, suitable for the load-bearing requirements of precision molds.
Excellent low-temperature toughness (mechanical stability at -40°C), high temperature tolerance up to 130°C.
Electrical properties:
Stable dielectric constant (≤5.5 @1MHz), low dielectric loss (≤0.04), dry/wet insulation resistance are higher than industry standards.
Flame retardancy: UL94V0 certified, self-extinguishing time after burning ≤10 seconds, meeting electronic equipment safety regulations.
Processing adaptability:
Supports precision processing such as CNC and laser cutting, edge flatness error ≤0.05mm.
Low water absorption (≤19mg under D-24/23 standard), dimensional stability is better than ordinary engineering plastics
Core selling point of the product
Multi-scenario applicability:
Optional colors (yellow/white/black/aqua), smooth surface without pits, meeting the needs of appearance customization.
High cost performance:
The cost of raw materials is 30%-50% lower than that of metal substrates, and the processing loss rate is ≤3%.
Environmental compliance:
Compliant with the RoHS directive, halogen-free formula reduces the risk of environmental pollution.
Application areas
Electronic switch molds:
As insulating support bars and contact fixing plates, they can solve the problem of high-voltage arc breakdown.
Precision structural parts:
Used for wafer grinding gears and test fixtures, replacing traditional metal parts to reduce weight.
Extended scenarios:
High-frequency communication equipment (such as 5G base station RF module insulation pads).
New energy vehicle electronic control systems (battery pack insulation isolation plates, charging pile components)
| Property | Bakelite sheet | FR4 sheet |
| Base Material | Phenolic resin + wood pulp/cotton fabric | Epoxy resin + glass fiber |
| Cost | Lower | Higher |
| Temperature Resistance | 100-130°C | 130-180°C (higher for epoxy board) |
| Electrical Performance | Medium/Low Voltage Insulation | High-Frequency/High Voltage Insulation (superior) |
| Typical Applications | Mechanical parts, medium/low voltage electrical devices | PCB substrates, high-end insulating components |
| Comparison Table: 3240 Epoxy Glass Sheet vs. FR4 Sheet | ||
| Characteristics | 3240 Epoxy Glass Sheet | FR4 Sheet |
| Main Applications | Structural insulation parts, mechanical support | Printed circuit board (PCB) substrate |
| Key Processing Techniques | Mechanical processing (cutting, drilling) | PCB processes (etching, copper plating, etc.) |
| Key Performance Focus | Mechanical strength, insulation | High-frequency signal transmission, dielectric stability |
| Typical Thickness | 0.5mm–50mm (thicker) | 0.2mm–3.2mm (thinner) |
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