high definition CCD alignment system bga rework machin e

Features                                                                

1. Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired

2. Suitable for LED lamp beads of tape packaging and bulk materials, Also any BGA and components which are difficult to repair.

3. High solution optical alignment system, accurate LED components positioning, ensure precise mounting.

4. Optical alignment is controlled electrically, can rotate automatically

5. Mounting head built-in pressure testing device, to protect the PCB

6. Built-in infrared laser positioning, fast positioning for PCB.

7. Adopt HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running.

8. Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevents PCB to turn yellow.

9. Bottom heater up and down manually can adjust the heating height real time.

10. Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serves life

11. Human-machine interface has multiple operation mode and permission, soldering, desoldering and mounting manually, easy operation.

12. High resolution touch screen, which is up to 800*600 pixels

13. Adopt joystick control for alignment system, no need setting complicated parameters

14.Adopt Delta double ball bearing flow fan for air supply,no need external air source

15. Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment

16. Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC, which will close output channel and display fault condition. Protect it automatically

Main technical and parameter                                                    

Total Power                 Max 5360W                     

Power                      AC 220V±10%   50/60 Hz               

Top heater power             1200W

Bottom heater power          1200W

IR power                    2700W

Hot air temp                 400℃ (Max)

Preheating temp              400℃(Max)

Positioning                   V-groove +laser positioning+ universal fixture

PCB size                     Max 410×370 mm

Preheating size                370mm×270mm

Chip type                     BGA, QGN, CSP, POP, QFN, Micro SMD, LED lamp beads

Chip size                     Max 80×80mm        Min 2×2 mm

Dimensions                   L640×W630×H920 mm

Temperature sensor             1Pc

Net weight                    70kG

Color                         Brown