BGA169(eMMC) Reball Kit_14X18mm,NAND flash repair, BGA169 reballing, NAND flash reballing, eMMC replacement

Get Latest Price

Quantity:

Your message must be between 20 to 2000 characters

Contact Now

Basic Info

Place of Origin:	China
Payment Type:	T/T,Western Union

Product Description

Aluminum alloy structure, lightweight and durable structure

Precision IC guide, accurate positioning.

Steel Dimensions: (80 x 80) mm, apply to BGA 169, size: 14X18mm.

The unique tin ball storage room design, no need to poure out excess solder ball every time, make production more efficiency.

For more other BGA Reballing Kit, please contact our sales man.

Sireda Technology also provides Rework Solution. We have much experience in BGA Reballing, especially in POP Reballing. High yield rate guaranteed.

Send your message to this supplier

Related Keywords