
High quality Lead Free Welding Soldering Reflow Oven for SMT production line
- Delivery Time:
- 3 Days
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Contact NowPlace of Origin: | Guangdong, China (Mainland) |
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Applicable scope | |
Solder paste type | Lead-free solder/ordinary solder |
Max processable size of base board (mm) | 350(W)*300(L) |
Component type | Single/double sided board such as CSP, BGA, etc. |
Machine | |
Dimensions L*W*H(mm) | 4900*1350*1450mm |
Weight | 1600kg |
Temperature area | 8 upper areas, 8 lower areas, 16 temperature controller and 2 special cooling areas |
Temperature control | |
Temperature controlling method | Individual PID control in each temperature area |
Temperature control precision | ±1℃ |
PCB temperature tolerance | ±2℃ |
Temperature range | Room temperature~350℃ |
Rising time (cool start) | Within 30 minutes |
Temperature stability time | Within 5 minutes |
Conveying mechanism | |
Width of conveying belt | 480mm |
Conveying method | Chain/net conveyor |
Net Conveyor speed | Speed of 390mm conveyor is the same as that of chain |
Direction of net conveyor | Left→Right (Right→Left) |
Height of conveying chain | 900±20mm |
Conveying speed | 0-1800mm/min |
Conveyor rail | Special deformation resistance material |
Chain stretchable length | <=3.5mm |
Chain takeup device | Automatic takeup |
Chain lubrication | Automatic oil feeding device |
Supporting mechanism | (Optional) supporting chain synchronizes with chain |
Control system | |
Power supply | 3ø380V |
Startup power/Normal working power | 45KW/9KW |






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