Shenzhen Leiming Electronic Co.,Ltd.
Shenzhen Leiming Electronic Co.,Ltd.
Edge Plated With Gold pcb Desigh Software
  • Edge Plated With Gold pcb Desigh Software
Edge Plated With Gold pcb Desigh Software

Edge Plated With Gold pcb Desigh Software

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Basic Info
Basic Info
Place of Origin: Guangdong, China (Mainland)
Product Description
Product Description
 
 
Welcome to RayMing Technology!!!
Any question,pls contact Nail Ding freely.  
 
Primary Competitive Advantages:
  • Experienced Staff
  • Green Product
  • Guarantee/Warranty
  • International Approvals
  • Packaging
  • Price
  • Product Features
  • Product Performance
  • Prompt Delivery
  • Quality Approvals
  • Service
  • Small Orders Accepted

 

Printed Circuit Board,China PCB,PCB Manufacturing,PCB Manufacturers,express PCB, PCB Prototypes,PCB Prototyping,Prototype PCB.Lead Free HASL PCB

rigid board,FPC,Flexible Printed Circuit,flex board, PCBA,pcb facture ,pcb design,pcb layout,pcb assembly, copy pcb.

pcb maker,quick turn pcb,  multilayer pcb, high multilayer pcb, circuit board, hf pcb, hdi pcb, pcb, teflon pcb

-Lead free HASL Surface finish required to meet ROHS compliant

-FR4 material with 0.2mm-3.2mm boards thickness

-Copper weight:0.5OZ,1OZ,2OZ,3OZ

-4-4mils track width spacing

-0.2mm min finished hole size

-Certificate: UL, ROHS, T/S16949 -Company management: ISO9001:2000 -Markets: Europe, America, Asia

 

 

Factory Manufacture Capability.

Item

Manufacture Capability

Material

FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based

Layer No.

1-16

Finished Board thickness

0.2 mm-3.8mm’(8 mil-150 mil)

 

Board Thickness Tolerance

±10%

Cooper thickness

0.5 OZ-11OZ (18 um-385 um)

Copper Plating Hole

18-40 um

Impedance Control

±10%

Warp&Twist

0.70%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Images

Min Trace Width (a)

0.1mm (4 mil)

 

Min Space Width (b)

0.1mm (4 mil)

Min Annular Ring

0.1mm (4 mil)

 

SMD Pitch (a)

0.2 mm(8 mil)

 

BGA Pitch (b)

0.2 mm (8 mil)

   

Solder Mask

Min Solder Mask Dam (a)

0.0635 mm (2.5mil)

 

Soldermask Clearance (b)

0.1mm (4 mil)

Min SMT Pad spacing (c)

0.1mm (4 mil)

Solder Mask Thickness

0.0007"(0.018mm)

Holes

Min Hole size (CNC)

0.2 mm (8 mil)

Min Punch Hole Size

0.9 mm (35 mil)

Hole Size Tol (+/-)

PTH:±0.075mm;NPTH: ±0.05mm

Hole Position Tol

±0.075mm

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel 3-7um Au:1-5u''

OSP

0.2-0.5um

Outline

Panel Outline Tol (+/-)

CNC: ±0.125mm, Punching: ±0.15mm

Beveling

30°45°

Gold Finger angle

15° 30° 45° 60°

Certificate

ROHS, ISO9001:2008, SGS, UL certificate

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