Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd
SMT PCB Assembly / PCB Assembling Design Service 10mil 1OZ
  • SMT PCB Assembly / PCB Assembling Design Service 10mil 1OZ
SMT PCB Assembly / PCB Assembling Design Service 10mil 1OZ

SMT PCB Assembly / PCB Assembling Design Service 10mil 1OZ

Min. Order:
1
Min. Order:
1
Delivery Time:
30 Days
Quantity:

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Basic Info
Basic Info
Place of Origin: China
Product Description
Product Description

Electronic One Stop Turnkey PCBA SMT PCB Assembly 10mil 1OZ FR4 2 layer Raw Board

Specification:

Service

PCB,PCBA

Cu THK

1OZ

PCBA QC

X-ray,AOI test

Line width

10mil

Surface finishing

HASL lead free

Line space

10 mil

Material raw

FR4 2 layer

Processing

SMT

Quick detail:

  • Model:XCES-1
  • Solder mask:Green,white silk screen
  • Size:4*2cm
  • Location:Shenzhen
  • Application:
  • Industrial control
  • Alarm products
  • Measurement device
  • Telecom audio and video
  • Electronic security health and medical
  • LED application test instrument
  • Consumer electronics

Parameter

1

Layer

2 layer

2

Material

FR-4 lead free

3

Board thickness

1.2mm

4

Finished board side

40*20mm

5

Min.drilled hole size

0.25mm

6

Min.line width

0.25mm

7

Min.line spaceing

0.25mm

8

Surface finish/treatment

HALS/HALS lead free

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

Standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,CQC

15

Profiling Punching

Routing,V-CUT,Beveling

16

Assembly Service

Providing OEM service to all sorts of printed circuit board assembly

Advantage:

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

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