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Immersion gold High TG Embedded components pcb smt , HDI PC
  • Immersion gold High TG Embedded components pcb smt , HDI PC
Immersion gold High TG Embedded components pcb smt , HDI PC

Immersion gold High TG Embedded components pcb smt , HDI PC

Min. Order:
1
Min. Order:
1
Delivery Time:
30 Days
Quantity:

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Basic Info
Basic Info
Place of Origin: Shenzhen, China
Product Description
Product Description

Immersion gold High TG Embedded components pcb smt , HDI PCB Board 4-Layer

Specifications

1.ROHS compliant PCB
2.ROHS/UL/ISO9001
3.PCB layout design
4.Best after sales service
5.PCB SMT factory


WonDa, your single point of contact for all of your raw materials, parts, and pcb assembly, also offers:


- Engineering Services
- PCB Design & Assembly
- Product Design
- Prototyping
- Cable and Wire Assemblies
- Plastics and Molds

Detailed Specification of PCB Manufacturing

1

Layer

1-28 layer

2

Material

FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,Aluminum, Ceramic, Rogers,F4B,Teflon

3

Board thickness

0.2mm-6.0mm

4

Max.finished board side

550mm*1100mm(single-sided)

550mm*640mm(multilayer)

5

Min.drilled hole size

0.15mm

6

Min.line width

0.076mm(3mil)

7

Min.line spaceing

0.076mm(3mil)

8

Surface finish/treatment

HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

Standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,CQC

15

Profiling Punching

Routing,V-CUT,Beveling

16

Assembly Service

Providing OEM service to all sorts of printed circuit board assembly

Detailed Terms for Pcb Assembly

Technical requirement:

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

Quote requirement:

1)Gerber file and Bom list

2)Clear pictures of pcb/ fpc/ pcba or pcba sample for us

3)The PCB specification: Copper thickness(18um or 35um?); Finished board thickness(0.8mm or 1.6mm?);

Surface treatment(lead-free HASL or immersion gold?)

4)Test method for PCB/PCBA

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