Shenzhen LumiS Technology Co., Ltd.
Shenzhen LumiS Technology Co., Ltd.
0.2W 2835 SMD LED with Epistar Chip
  • 0.2W 2835 SMD LED with Epistar Chip
  • 0.2W 2835 SMD LED with Epistar Chip
  • 0.2W 2835 SMD LED with Epistar Chip
0.2W 2835 SMD LED with Epistar Chip
0.2W 2835 SMD LED with Epistar Chip
0.2W 2835 SMD LED with Epistar Chip

0.2W 2835 SMD LED with Epistar Chip

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T/T
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Basic Info
Basic Info
Place of Origin: Shenzhen
Payment Type: T/T
Product Description
Product Description

Description:


. This White Colored surface-mount LED

.Size in Standard Package: 2.8x3.5x0.75mm

. It has a substrate made up of a molded

. The PCT package design is ensured with high quality component materials that allow these products to perform with high reliability.
 

0.2W 2835 SMD LED with Epistar Chip


Features and Benefits:

Wide Viewing Angle: 140°

. Mid Power to High Power, up to 0.24W

. Max. Driving Current 80mA

. Low Thermal Resistance:18ºC/W

. High Color Quality with CRI Min. 80

Pb-free Reflow Soldering Application

Size: 0.2W 2835 SMD LED with Epistar ChipKey Applications:

. Retrofits(replacement)

. General lighting

. Indoor & Outdoor sign board back light

. Architectural / Decorative lighting


Soldering Pad: 0.2W 2835 SMD LED with Epistar ChipCaution:

 

1.Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. 
2. Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. 
3. Die slug is to be soldered. 
4. When soldering, do not put stress on the LEDs during heating. 
5. After soldering, do not warp the circuit board.


Notes on LumiS PCT Series soldering:
 

1.Recommend to use reflow machine.
2.Recommend to use heating plate soldering.
3.Manual soldering is not recommended.


Notes on reflow process:
 

1.To confirm whether the actual temperature curve in the reflow soldering conditions comply with recommended conditions. LEDs are guaranteed for one time reflow.
2.During reflow process do not apply force on LED active area.
3.After reflow process, PCB board should be cooled down before packing or storage.
 

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