Double Side Immersion Gold LED PCB (PCB LED)

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Basic Info

Place of Origin:	Shenzhen, China
Payment Type:	T/T, Paypal, Western Union

Product Description

Testing Procedures For PCB Board:
* Flying probe
* Impedance control
* Solder-ability detection
* Digital metallograghic microscope
* AOI (Automated Optical Inspection)

How to get a quote?
Pls send gerber file with these format: . PCB /. P-CAD /. DXP /. CAD /. Gerber
A) Base material: FR4/ AL/ FPC/ CEM-1/ CEM-3/ 94v0/ Rogers
B) Board thickness: 1.6mm-3.2mm/ 0.3mm-1.2mm
C) Copper thickness: Hoz/ 1oz/ 2oz/ 3oz/ 4oz, ect
D) Surface treatment: HASL/ ENIG/ LF-HAL/ Immersion Tin/ Immersion Sin/ OSP
E) color of solder mask and silkscreen: Green/White/Black/Red/Blue/Yellow
F) Quantity and board size

Delivery Time for PCB board:
1) PCB production time: Sample: 4-5 days / production: Within 9 days
2) Component purchase: 2 days if all components is available in our domestic market.
PCB Assembly: Samples: Within 5 days / mass production: Within 9 days

Shipping Method and Payment terms:
1. By DHL, UPS, FedEx, TNT using clients account.
2. We suggest you using our DHL, UPS, FedEx, TNT forwarder.
3. By EMS (Usually for Russia Clients), price is high.
4. By sea for mass quantity according to customer's requirement.
5. By customer's Forwarder
6. By Paypal, T/T, West Union, etc.

Files	Gerber, Protel, Powerpcb, Autocad, Orcad, etc
Material	FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , FR1, CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic), Polymide.
Layer No.	1 - 20 Layers
Board thickness	0.0075"(0.2mm)-0.125"(3.2mm)
Board Thickness Tolerance	±10%
Copper thickness	0.3OZ - 6OZ
Impedance Control	±10%
Warp and Twist	≤0.075%
Peel Strength	≥61B/in(≥107g/mm)
Min Trace Width (a)	3mil
Min Space Width (b)	3mil
Min Annular Ring	0.004"(0.1mm)
SMD Pitch (a)	0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)	0.027"(0.675mm)
Register tolerance	0.05mm
Min Solder Mask Dam (a)	0.005"(0.125mm)
Solder mask Clearance (b)	0.005"(0.125mm)
Min SMT Pad spacing (c)	0.004"(0.1mm)
Solder Mask Thickness	0.0007"(0.018mm)
Hole size	0.008"(0.20mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)	±0.003"(±0.0762mm)
Max PTH Aspect Ratio	10:1
Hole Registration	0.003"(0.075mm)
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel 3-7um Au:1-3u''
OSP	0.2-0.5um
Panel Outline Tol (+/-)	±0.004''(±0.1mm)
Beveling	30°45°
V-cut	15° 30° 45° 60°
Surface finish	HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate	ROHS ISO9001 TS16949 SGS UL
Special requirements	Buried&blind vias, Impedance control, via plug, BGA soldering and gold finger

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