6 Layer Green Multi Layer PCB FR4 HASL ( Lead Free ) Surfac
- Min. Order:
- 1
- Min. Order:
- 1
- Delivery Time:
- 30 Days
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Contact Now| Place of Origin: | China |
|---|
6 Layer Green Multi Layer PCB FR4 HASL ( Lead Free ) Surface HDI Printed Circuit Board
Quick Details:
1. One of the largest and professional PCB (Printed Circuit Board) manufacturers in China with over 500
staff and 20 years’experience.
2. All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver, Immersion Tin, Immersion
Gold, Lead-free HASL,HAL.
3. BGA,Blind&Buried Via and Impedance Control is accepted.
4. Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine,
CNC drilling machine,Auto-PTH line,AOI(Automatic Optic Inspection),Probe Flying Machine and so on.
5. Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.
6. One of the professional SMT/BGA/DIP/PCB Assembly manufacturers in China with 20
years’experience.
7. High speed advanced SMT lines to reach chip +0.1mm on integrated circuit parts.
8. All kinds of integrated circuits is available,such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-
BGA.
9. Also available for 0201 chip placement, through-hole components insertion and finished products
fabrication, testing and package.
10. SMD assembly and through-hole components insertion is accepted.
11. IC preprogramming is also accepted.
12. Available for Function verification and burn in testing.
13. Service for complete unit assembly,for example,plastics, metal box, coil, cable inside .
14. Environmental conformal coating to protect finished PCBA products.
15. Providing Engineering service as end of life components, obsolete component replace and design
support for circuit, metal and plastic enclosure.
16. Functional testing,repairs and inspection of the sub-finished and finished goods.
17. High mixed with low volume order is welcomed.
18. Products before delivery should be full quality checked, striving to 100% perfect.
19. One-stop service of PCB and SMT(PCB assembly) is supplied to our customers.
20. Best service with punctual delivery is always provided for our customers.
| PRODUCT’S DETAILS | |
| Raw Material | FR-4(Tg 180) |
| Layer Count | 6-Layer |
| Board Thickness | 2.0mm |
| Copper Thickness | 2.0oz |
| Surface Finish | HASL(LEAD FREE) |
| Solder Mask | Green |
| Silkscreen | White |
| Min. Trace Width/Spacing | 0.075/0.075mm |
| Min. Hole Size | 0.25mm |
| Hole Wall Copper Thickness | ≥20μm |
| Measurement | 300×400mm |
| Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
| Application | Communication,automobile,cell,computer,medical |
| Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
| Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
| PRODUCTION CAPABILITY OF PCB | ||
PROCESS Engineer |
ITEMS Item | PRODUCTION CAPABILITY Manufacturing Capability |
| Laminate | Type | FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON |
| Thickness | 0.2~3.2mm | |
| Production Type | Layer Count | 2L-16L |
| Surface Treatment | HAL,HASL,Gold Plating,Immersion Gold,OSP, Immersion Silver,Immersion Tin,Lead Free HAL |
|
| Cut Lamination | Max. Working Panel size | 1000×1200mm |
| Inner Layer | Internal Core Thickness | 0.1~2.0mm |
| Internal width/spacing | Min: 4/4mil | |
| Internal Copper Thickness | 1.0~3.0oz | |
| Dimension | Board Thickness Tolerance | ±10% |
| Interlayer Alignment | ±3mil | |
| Drilling | Manufacture Panel Size | Max: 650×560mm |
| Drilling Diameter | ≧0.25mm | |
| Hole Diameter Tolerance | ±0.05mm | |
| Hole Position Tolerance | ±0.076mm | |
| Min.Annular Ring | 0.05mm | |
| PTH+Panel Plating | Hole Wall copper Thickness | ≧20um |
| Uniformity | ≧90% | |
| Outer Layer | Track Width | Min: 0.08mm |
| Track Spacing | Min: 0.08mm | |
| Pattern Plating | Finished Copper Thickness | 1oz~3oz |
| EING/Flash Gold | Nickel Thickness | 2.5um~5.0um |
| Gold Thickness | 0.03~0.05um | |
| Solder Mask | Thickness | 15~35um |
| Solder Mask Bridge | 3mil | |
| Legend | Line width/Line spacing | 6/6mil |
| Gold Finger | Nickel Thickness | ≧120u〞 |
| Gold Thickness | 1~50u〞 | |
| Hot Air Level | Tin Thickness | 100~300u〞 |
| Routing | Tolerance of Dimension | ±0.1mm |
| Slot Size | Min:0.4mm | |
| Cutter Diameter | 0.8~2.4mm | |
| Punching | Outline Tolerance | ±0.1mm |
| Slot Size | Min:0.5mm | |
| V-CUT | V-CUT Dimension | Min:60mm |
| Angle | 15°30°45° | |
| Remain Thickness Tolerance | ±0.1mm | |
| Beveling | Beveling Dimension | 30~300mm |
| Test | Testing Voltage | 250V |
| Max.Dimension | 540×400mm | |
| Impedance Control | Tolerance |
±10% |
| Aspect Ration | 12:1 | |
| Laser Drilling Size | 4mil(0.1mm) | |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering and Gold Finger Are Acceptable |
|
| OEM&ODM Service | Yes | |
