High Tg 180 FR4 Power Supplier Multi Layer PCB Green Solder
- Min. Order:
- 1
- Min. Order:
- 1
- Delivery Time:
- 30 Days
Your message must be between 20 to 2000 characters
Contact Now| Place of Origin: | China |
|---|
High Tg 180 FR4 Power Supplier Multi Layer PCB Green Solder Mask
Quick Details:
- PCBA,OEM,ODM service are provided.
- Gerber file needed.
- Quality guarantee and professional after-sale service.
- Professional PCB manufacturer.
|
PCB DESCRIPTION |
|
|
Material |
FR4 High Tg-180 |
|
Board Thickness |
2.0 mm |
|
Layer Count |
4-Layer |
|
Copper Thickness |
2.0 oz |
|
Surface Finish |
Immerssion Tin |
|
Solder Mask |
Green |
|
Silkscreen |
White |
|
Trace Spacing |
0.030/0.030mm |
|
Hole Size |
0.25mm |
|
Hole Copper Thickness |
≥20μm |
|
Measurement |
64×42mm |
|
Packing |
Outer: Cardboard Cartons with double straps Inner: Vacuum-packed in soft plastic bales |
|
Certificates |
HALOGEN-FREE,UL,ISO9001:2008,ROHS,REACH,SGS |
|
Advantage |
OEM&ODM,Competitive Price,Fast Delivery,Free Samples, |
|
Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
|
Applications |
Communication,automobile,cell,computer,medical |
|
CAPABILITY OF PCB PRINTED CIRCUIT BOARD |
||
|
Engineering Process |
Items |
Production Capability |
|
Laminate Board |
Board Thickness |
0.2~3.2mm |
|
Product Type |
Layers |
2L-16L |
|
Cut Lamination |
Max. Working Panel size |
1000×1200mm |
|
Layers Inside |
Core Thickness inside |
0.1~2.0mm |
|
Internal spacing |
Min: 4/4mil |
|
|
Internal Copper Thickness |
1.0~3.0oz |
|
|
Tolerance |
Board Thickness Tolerance |
±10% |
|
Inter layer Alignment |
±3mil |
|
|
Drilling |
Panel Measurement |
Max: 660×600mm |
|
Drilling Dimension |
≧0.25mm |
|
|
Hole Diameter Tolerance |
±0.05mm |
|
|
Hole Position Tolerance |
±0.076mm |
|
|
Min.Annular Ring |
0.05mm |
|
|
PTH+Panel Plating |
Hole Wall copper Thickness |
≧20um |
|
Uniformity |
≧90% |
|
|
Outer Layer |
Track Width |
Min: 0.08mm |
|
Track Spacing |
Min: 0.08mm |
|
|
Pattern Plating |
Finished Copper Thickness |
1oz~3oz |
|
EING/Flash Gold |
Nickel Thickness |
2.5um~5.0um |
|
Gold Thickness |
0.03~0.05um |
|
|
Solder Mask |
Thickness |
15~35um |
|
Solder Mask Bridge |
3mil |
|
|
Legend |
Line width/Line spacing |
6/6mil |
|
Gold Finger |
Nickel Thickness |
≧120u〞 |
|
Gold Thickness |
1~50u〞 |
|
|
Beveling |
Beveling Dimension |
30~300mm |
|
Routing |
Tolerance of Dimension |
±0.1mm |
|
Slot Size |
Min:0.4mm |
|
|
Cutter Diameter |
0.8~2.4mm |
|
|
Punching |
Outline Tolerance |
±0.1mm |
|
Slot Size |
Min:0.5mm |
|
|
V-CUT |
V-CUT Dimension |
Min:60mm |
|
Angle |
15° 30° 45° |
|
|
Remain Thickness Tolerance |
±0.1mm |
|
|
Hot Air Level |
Tin Thickness |
100~300u〞 |
|
Test |
Testing Voltage |
250V |
|
Max.Dimension |
680×600mm |
|
|
Impedance Control |
Tolerance |
±10% |
|
Aspect Ration |
12:1 |
|
|
Laser Drilling Size |
4mil(0.1mm) |
|
