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China PCB Prototype Board Online Market
4 Layer FR4 Multi Layer PCB UL Marked RED Solder Mask for P
  • 4 Layer FR4 Multi Layer PCB UL Marked RED Solder Mask for P
4 Layer FR4 Multi Layer PCB UL Marked RED Solder Mask for P

4 Layer FR4 Multi Layer PCB UL Marked RED Solder Mask for P

Min. Order:
1
Min. Order:
1
Delivery Time:
30 Days
Quantity:

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Basic Info
Basic Info
Place of Origin: China
Product Description
Product Description

4 Layer FR4 Multi Layer PCB UL Marked RED Solder Mask for Power Supplier

Quick Details:

  1. Professional PCB manufacturer.
  2. Quality guarantee and professional after-sale service.
  3. Gerber file needed.

PCB Descriptions

Basic Material

High Tg-180 FR4

Board Thickness

2.0 mm

Layer Count

4-Layer

Copper Thickness

1.0 oz

Surface Finish

LEAD FREE HASL

Solder Mask

RED

Silkscreen

White

Trace Spacing

0.030/0.030mm

Hole Size

0.25mm

Hole Copper Thickness

≥20μm

Measurement

64×42mm

Packing

Outer: Cardboard Cartons with double straps

Inner: Vacuum-packed in soft plastic bales

Certificates

UL,ISO9001:2008,ROHS,REACH,SGS

Advantage

OEM&ODM,Competitive Price,Fast Delivery,

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable

Applications

Communication,automobile,cell,computer,medical


PRODUCTION OF PCB PRINTED CIRCUIT BOARD

Engineering Process

Items

Production Capability

Laminate Board

Board Thickness

0.2~3.2mm

Product Type

Layers

2L-16L

Lamination

Max. Panel size

500×600mm

Layers Inside

Core Thickness inside

0.1~2.0mm

Internal Tracing

Min: 4/4mil

Internal Copper Thickness

1.0~3.0oz

Dimension Tolerance

Board Thickness Tolerance

±10%

Inter layer Alignment

±3mil

Drilling Tolerance

Panel Measurement

Max: 660×600mm

Drilling Dimension

≧0.25mm

Hole Diameter Tolerance

±0.05mm

Hole Position Tolerance

±0.076mm

Min.Annular Ring

0.05mm

PTH+Panel Plating

Hole Wall copper Thickness

≧20um

Uniformity

≧90%

Outer Layer

Track Width

Min: 0.08mm

Track Spacing

Min: 0.08mm

Plating Pattern

Finished Copper Thickness

1oz~2oz

EING/Flash Gold

Nickel Thickness

2.5um~5.0um

Gold Thickness

0.03~0.05um

Solder Mask

Thickness

15~35um

Solder Mask Bridge

3mil

Length

Line width/Line spacing

6/6mil

ENIG

Nickel Thickness

≧120u〞

Gold Thickness

1~50u〞

Beveling

Beveling Dimension

30~300mm

Routing

Tolerance of Dimension

±0.1mm

Slot Size

Min:0.4mm

Cutter Diameter

0.8~2.4mm

Punching

Outline Tolerance

±0.1mm

Slot Size

Min:0.5mm

V-CUT

V-CUT Dimension

Min:60mm

Angle

15° 30° 45°

Remain Thickness Tolerance

±0.1mm

Hot Air Level

Tin Thickness

100~300u〞

Test

Testing Voltage

250V

Max.Dimension

680×600mm

Impedance Control

Tolerance

±10%

Aspect Ration

12:1

Laser Drilling Size

4mil(0.1mm)

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