China PCB Prototype Board Online Market
China PCB Prototype Board Online Market
FR4 Raw Material RED Solder Multi Layer PCB Custom PCB OEM
  • FR4 Raw Material RED Solder Multi Layer PCB Custom PCB OEM
FR4 Raw Material RED Solder Multi Layer PCB Custom PCB OEM

FR4 Raw Material RED Solder Multi Layer PCB Custom PCB OEM

Min. Order:
1
Min. Order:
1
Delivery Time:
30 Days
Quantity:

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Basic Info
Basic Info
Place of Origin: China
Product Description
Product Description

FR4 Raw Material RED Solder Multi Layer PCB Custom PCB OEM Service

Descriptions:

  1. Gerber file needed.
  2. Quality guarantee and professional after-sale service.
  3. Professional PCB manufacturer.
  4. PCBA,OEM,ODM service are provided.

PCB DETAILS

Material

High Tg-180FR4

Board Thickness

2.0 mm

Layer Count

4-Layer

Copper Thickness

1.0 oz

Surface Finish

HASL LEAD FREE

Solder Mask

RED

Silkscreen

White

Trace Spacing

0.030/0.030mm

Hole Size

0.25mm

Hole Copper Thickness

≥20μm

Measurement

64×42mm

Packing

Outer: Cardboard Cartons with double straps

Inner: Vacuum-packed in soft plastic bales

Certificates

HALOGEN-FREE,UL,ISO9001:2008,ROHS,REACH,SGS

Advantage

OEM&ODM,Competitive Price,Fast Delivery,Free Samples,

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable

Applications

Communication,automobile,cell,computer,medical


PRODUCTION OF PCB PRINTED CIRCUIT BOARD

Engineering Process

Items

Production Capability

Laminate Board

Board Thickness

0.2~3.2mm

Product Type

Layers

2L-16L

Lamination

Max. Panel size

1000×1200mm

Layers Inside

Core Thickness inside

0.1~2.0mm

Internal spacing

Min: 4/4mil

Internal Copper Thickness

1.0~3.0oz

Dimension Tolerance

Board Thickness Tolerance

±10%

Inter layer Alignment

±3mil

Drilling

Panel Measurement

Max: 660×600mm

Drilling Dimension

≧0.25mm

Hole Diameter Tolerance

±0.05mm

Hole Position Tolerance

±0.076mm

Min.Annular Ring

0.05mm

PTH+Panel Plating

Hole Wall copper Thickness

≧20um

Uniformity

≧90%

Outer Layer

Track Width

Min: 0.08mm

Track Spacing

Min: 0.08mm

Plating Pattern

Finished Copper Thickness

1oz~2oz

EING/Flash Gold

Nickel Thickness

2.5um~5.0um

Gold Thickness

0.03~0.05um

Solder Mask

Thickness

15~35um

Solder Mask Bridge

3mil

Legend

Line width/Line spacing

6/6mil

Gold Finger

Nickel Thickness

≧120u〞

Gold Thickness

1~50u〞

Beveling

Beveling Dimension

30~300mm

Routing

Tolerance of Dimension

±0.1mm

Slot Size

Min:0.4mm

Cutter Diameter

0.8~2.4mm

Punching

Outline Tolerance

±0.1mm

Slot Size

Min:0.5mm

V-CUT

V-CUT Dimension

Min:60mm

Angle

15° 30° 45°

Remain Thickness Tolerance

±0.1mm

Hot Air Level

Tin Thickness

100~300u〞

Test

Testing Voltage

250V

Max.Dimension

680×600mm

Impedance Control

Tolerance

±10%

Aspect Ration

12:1

Laser Drilling Size

4mil(0.1mm)

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