BGA Custom Printed Circuit Board PCB Rigid Plate Gold Finge
- Min. Order:
- 1
- Min. Order:
- 1
- Delivery Time:
- 30 Days
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Contact Now| Place of Origin: | China |
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BGA Soldering Printed Circuit Board PCB Rigid Plate Gold Finger HASL UL
Characteristics:
1. Professional PCB manufacturer.
2. PCBA,OEM,ODM service are provided.
3. Gerber file needed.
4. Products are 100% E-tested.
5. Quality guarantee and professional after-sale service.
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PRODUCT’S DETAILS |
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Raw Material |
FR-4 (Tg 180 available) |
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Layer Count |
6-Layer |
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Board Thickness |
1.6mm |
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Copper Thickness |
2.0oz |
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Surface Finish |
HASL(lead-free) |
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Solder Mask |
Green |
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Silkscreen |
White |
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Min. Trace Width/Spacing |
0.075/0.075mm |
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Min. Hole Size |
0.25mm |
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Hole Wall Copper Thickness |
≥20μm |
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Measurement |
300×400mm |
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Packaging |
Inner: Vacuum-packed in soft plastic bales |
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Application |
Communication,automobile,cell,computer,medical |
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Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
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Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
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Certification |
UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
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PRODUCTION CAPABILITY OF PCB |
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ITEMS Item |
Capability |
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Laminate |
Type |
FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, TEFLON |
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Thickness |
0.2~3.2mm |
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Production Type |
Layer Count |
2L-16L |
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Surface Treatment |
HAL,Gold Plating,Immersion Gold,OSP,Immersion Silver,Immersion Tin,Lead Free HAL |
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Cut Lamination |
Max. Working Panel size |
1000×1200mm |
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Inner Layer |
Internal Core Thickness |
0.1~2.0mm |
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Internal width/spacing |
Min: 4/4mil |
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Internal Copper Thickness |
1.0~3.0oz |
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Dimension |
Board Thickness Tolerance |
±10% |
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Interlayer Alignment |
±3mil |
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Drilling |
Manufacture Panel Size |
Max: 650×560mm |
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Drilling Diameter |
≧0.25mm |
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Hole Diameter Tolerance |
±0.05mm |
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Hole Position Tolerance |
±0.076mm |
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Min.Annular Ring |
0.05mm |
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PTH+Panel Plating |
Hole Wall copper Thickness |
≧20um |
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Uniformity |
≧90% |
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Outer Layer |
Track Width |
Min: 0.08mm |
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Track Spacing |
Min: 0.08mm |
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Pattern Plating |
Finished Copper Thickness |
1oz~3oz |
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EING/Flash Gold |
Nickel Thickness |
2.5um~5.0um |
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Gold Thickness |
0.03~0.05um |
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Solder Mask |
Thickness |
15~35um |
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Solder Mask Bridge |
3mil |
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Legend |
Line width/Line spacing |
6/6mil |
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Gold Finger |
Nickel Thickness |
≧120u〞 |
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Gold Thickness |
1~50u〞 |
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Hot Air Level |
Tin Thickness |
100~300u〞 |
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Routing |
Tolerance of Dimension |
±0.1mm |
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Slot Size |
Min:0.4mm |
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Cutter Diameter |
0.8~2.4mm |
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Punching |
Outline Tolerance |
±0.1mm |
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Slot Size |
Min:0.5mm |
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V-CUT |
V-CUT Dimension |
Min:60mm |
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Angle |
15°30°45° |
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Remain Thickness Tolerance |
±0.1mm |
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Beveling |
Beveling Dimension |
30~300mm |
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Test |
Testing Voltage |
250V |
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Max.Dimension |
540×400mm |
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Impedance Control |
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±10% |
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Aspect Ration |
12:1 |
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Laser Drilling Size |
4mil(0.1mm) |
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Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering and Gold Finger Are Acceptable |
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OEM&ODM Service |
Yes |
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