Multi Layer DIP CSP Printed Circuit Board Assemblies For MP

Key Specifications/Special Features

1

We SYF have 6 PCB production lines and 4 advanced SMT lines with high speed.

2

All kinds of integrated circuits are accepted,such as SO, SOP, SOJ, TSOP, TSSOP, QFP, DIP, CSP,BGA and U-BGA , Because Our placement precision can reach chip +0.1mm on integrated circuit parts.

3

We SYF can provide service of 0201 chip placement, through-hole components insertion and finished products fabrication, testing and packaging.

4

SMT/SMD assembly and through-hole components insertion

5

IC preprogramming

6

Function verification and burn in testing

7

Complete unit assembly (which including plastics, metal box, coil, cable inside and more)

8

Environmental coating

9

Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure

10

Packaging design and production of customized PCBA

11

100% quality assurance

12

High mixed, low volume order is also welcomed.

13

Full component procurement or the substitute components sourcing

14

UL,ISO9001:2008, ROSH ,REACH,SGS,HALOGEN-FREE compliant

PRODUCTION CAPABILITY OF PCB ASSEMBLY

Stencil Size Range

756 mm x 756 mm

Min. IC Pitch

0.30 mm

Max. PCB Size

560 mm x 650 mm

Min. PCB Thickness

0.30 mm

Min. Chip Size

0201 (0.6 mm X 0.3 mm)

Max. BGA Size

74 mm X 74 mm

BGA Ball Pitch

1.00 mm (Min) / F3.00 mm (Max)

BGA Ball Diameter

0.40 mm (Min) /F1.00 mm (Max)

QFP Lead Pitch

0.38 mm (Min) /F2.54 mm (Max)

Frequency of Stencil Cleaning

1 time / 5 ~ 10 Pieces

Type of Assembly

SMT and Thru-hole

Solder Type

Water Soluble Solder Paste,Leaded and Lead-free

Type of Service

Turn-key,Partial Turn-key or consignment

File Formats

Bill of Materials(BOM)

Gerber Files

Pick-N-Places(XYRS)

Components

Passive Down to 0201 Size

BGA and VF BGA

Leadless Chip Carries/CSP

Double Sided SMT Assembly

BGA Repair and Reball

Part Removal and Replacement

Component Packaging

Cut Tape,Tube,Reels,Loose Parts

Testing Method

X-RAY Inspection and AOI Test

Order of Quantity

High Mixed,Low Volume Order is also welcomed

Remarks: In order to get accurate quote,the following information is required

1

Complete Data of Gerber Files for the Bare PCB Board.

2

Electronic Bill of Material(BOM) / Parts list detailing manufacturer's part number, quantity usage of components for reference.

3

Please state whether we can use alternative parts for passive components or not.

4

Assembly Drawings.

5

Functional Test Time Per Board.

6

Quality Standards Required

7

Send Us Samples (if available)

8

Date of the quote needs to be submitted

Note Book fields

CHARGER BOARD

INVERTER

POWER CPU

LVDS CARD

IR BOARD

LCD MOTHERBOARD

LED BOARD

RAM CARD

DATA BOARD

BATT BOARD

DVR MOTHERBOARD

USB BOARD

CARD READER

AUDIO BOARD

ISDN MODEN

PC fields

2.5 inch HDD

PC/MAC FDD

DOCKING
PORT

PORT REPILICATOR

PCMCIA CARD

3.5 inch HDD

SATA HDD

ADAPTER

DVD ROM

SSD

Telecom fields

DVBT.ATSC TV

GPS UNIT

CAR GPS UNIT

ADSL MODEN

3.5inch DVB-T RECEIVER

Audio & Video fields

MPEG 4 PLAYER

KVM SWITCH

E-BOOK READER

HDMI BOX

DVI BOX

Electronic Security fields

LCD TV MOTHERBOARD

DVR MOTHERBOARD

CCD BOARD

IP CAMERA

CCTV CAMERA

Health

& Medical fields

DIGITAL TEMS UNIT

EAR THERMOMETER

BLOOD GLUCOSE TEST METERS

BODY FAT MONITOR

DIGITAL BLOOD PRESSURE MONITOR

LED Application fields

LED AUTO LAMP

LED ROPE LIGHT

LED BULB

OUTDOOR

LED DISPLAY

PROJECTION LIGHTING

Test Instrument fields

OSCILLOSCOPE

POWER SUPPLY

L.C.R. METER

LOGIC ANALYZER

MULTIMETER

Consumer Electronics fields

SENSORS BOARD

DRIVER BOARD

USB DVIVER BOARD

BAR-CODE PRINTER

MP3 PLAYER

SOLAR PANEL MODULE

PEN TABLET

USB HUB

USB CARD READER

USB FLASH DRIVE